- 您现在的位置：买卖IC网 > PDF目录298893 > BX80552661 (INTEL CORP) 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775 PDF资料下载
参数资料
| 型号： | BX80552661 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 104/108页 |
| 文件大小： | 3283K |
| 代理商： | BX80552661 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页当前第104页第105页第106页第107页第108页
Datasheet
97
Boxed Processor Specifications
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the boxed
processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor temperature specification is in
Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature within the
specifications (see Table 5-1) in chassis that provide good thermal management. For the boxed
processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink
is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Airspace is required around the fan to ensure that the airflow through the fan heatsink is not
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan
life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. The
air temperature entering the fan should be kept below 38 °C. A Thermally Advantaged Chassis
with an Air Guide 1.1 is recommended to meet the 38 °C requirement. Again, meeting the
processor's temperature specification is the responsibility of the system integrator.
Note:
The processor fan is the primary source of airflow for cooling the VCC voltage regulator. Dedicated
voltage regulator cooling components may be necessary if the selected fan is not capable of
keeping regulator components below maximum rated temperatures.
Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket
B
C
R110
[4.33]
相关PDF资料 |
PDF描述 |
|---|---|
| BX80552651T2 | 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775 |
| BX80552641T | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| BX80552641T2 | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| BX805555060P | 64-BIT, MICROPROCESSOR, BGA771 |
| BX805555080P | 64-BIT, MICROPROCESSOR, BGA771 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80552661T2 | 制造商:Intel 功能描述:P4 661 3.6GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80553915 S L9KB | 制造商:Intel 功能描述: |
| BX80553915R S L9DA | 制造商:Intel 功能描述: |
| BX80553925 S L9KA | 制造商:Intel 功能描述: |
| BX80553945 S L9QQ | 制造商:Intel 功能描述:PENTIUM D PROCESSOR 945 |
发布紧急采购，3分钟左右您将得到回复。