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参数资料
| 型号： | BX80552661 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 91/108页 |
| 文件大小： | 3283K |
| 代理商： | BX80552661 |
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Datasheet
85
Thermal Specifications and Design Considerations
5.2.4
PROCHOT# Signal
An external signal, PROCHOT# (processor hot), is asserted when the processor die temperature
has reached its maximum operating temperature. If the Thermal Monitor is enabled (note that the
Thermal Monitor must be enabled for the processor to be operating within specification), the TCC
will be active when PROCHOT# is asserted. The processor can be configured to generate an
interrupt upon the assertion or de-assertion of PROCHOT#. Refer to the Intel Architecture
Software Developer's Manuals for specific register and programming details.
The processor implements a bi-directional PROCHOT# capability to allow system designs to
protect various components from over-temperature situations. The PROCHOT# signal is bi-
directional in that it can either signal when the processor has reached its maximum operating
temperature or be driven from an external source to activate the TCC. The ability to activate the
TCC via PROCHOT# can provide a means for thermal protection of system components.
One application is the thermal protection of voltage regulators (VR). System designers can create a
circuit to monitor the VR temperature and activate the TCC when the temperature limit of the VR
is reached. By asserting PROCHOT# (pulled-low) and activating the TCC, the VR can cool down
as a result of reduced processor power consumption. Bi-directional PROCHOT# can allow VR
thermal designs to target maximum sustained current instead of maximum current. Systems should
still provide proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in
case of system cooling failure. Refer to the applicable platform design guide and the Voltage
Regulator-Down (VRD) 10.1 Design Guide For Desktop and Transportable LGA775 Socket for
details on implementing the bi-directional PROCHOT# feature.
5.2.5
THERMTRIP# Signal
Regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled, in the event of a
catastrophic cooling failure, the processor will automatically shut down when the silicon has
reached an elevated temperature (refer to the THERMTRIP# definition in Table 4-3). At this point,
the FSB signal THERMTRIP# will go active and stay active as described in Table 4-3.
THERMTRIP# activation is independent of processor activity and does not generate any bus
cycles.
5.2.6
TCONTROL and Fan Speed Reduction
TCONTROL is a temperature specification based on a temperature reading from the thermal diode.
The value for TCONTROL will be calibrated in manufacturing and configured for each processor.
When TDIODE is above TCONTROL then TC must be at or below TC-MAX as defined by the thermal
profile in Table 5-2 and Figure 5-1; otherwise, the processor temperature can be maintained at
TCONTROL (or lower) as measured by the thermal diode.
The purpose of this feature is to support acoustic optimization through fan speed control. Contact
your Intel representative for further details and documentation.
5.2.7
Thermal Diode
The processor incorporates an on-die PNP transistor whose base emitter junction is used as a
thermal "diode", with its collector shorted to Ground. A thermal sensor located on the system board
may monitor the die temperature of the processor for thermal management and fan speed control.
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