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参数资料
型号： BX80552661
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775
封装： FLIP CHIP, LGA-775
文件页数： 32/108页
文件大小： 3283K
代理商： BX80552661
Datasheet
3
Contents
1
Introduction .............................................................................................................................13
1.1
Terminology ........................................................................................................................ 14
1.1.1
Processor Packaging Terminology ........................................................................ 14
1.2
References ......................................................................................................................... 15
2
Electrical Specifications .....................................................................................................17
2.1
Power and Ground Lands ................................................................................................... 17
2.2
Decoupling Guidelines ........................................................................................................17
2.2.1
VCC Decoupling .....................................................................................................17
2.2.2
VTT Decoupling ......................................................................................................17
2.2.3
FSB Decoupling ..................................................................................................... 18
2.3
Voltage Identification .......................................................................................................... 18
2.4
Reserved, Unused, and TESTHI Signals ........................................................................... 20
2.5
Voltage and Current Specification ...................................................................................... 21
2.5.1
Absolute Maximum and Minimum Ratings............................................................. 21
2.5.2
DC Voltage and Current Specification ................................................................... 22
2.5.3
VCC Overshoot.......................................................................................................26
2.5.4
Die Voltage Validation ........................................................................................... 26
2.6
Signaling Specifications ...................................................................................................... 27
2.6.1
FSB Signal Groups ................................................................................................ 27
2.6.2
GTL+ Asynchronous Signals ................................................................................. 29
2.6.3
Processor DC Specifications ................................................................................. 30
2.6.3.1
GTL+ Front Side Bus Specifications ...................................................... 33
2.7
Clock Specifications............................................................................................................ 34
2.7.1
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking .................................. 34
2.7.2
FSB Frequency Select Signals (BSEL[2:0])........................................................... 35
2.7.3
Phase Lock Loop (PLL) and Filter ......................................................................... 35
2.7.4
BCLK[1:0] Specifications ....................................................................................... 37
3
Package Mechanical Specifications ..............................................................................39
3.1
Package Mechanical Drawing ............................................................................................ 39
3.2
Processor Component Keep-Out Zones............................................................................. 43
3.3
Package Loading Specifications ......................................................................................... 43
3.4
Package Handling Guidelines............................................................................................. 43
3.5
Package Insertion Specifications ........................................................................................ 44
3.6
Processor Mass Specification............................................................................................. 44
3.7
Processor Materials ............................................................................................................ 44
3.8
Processor Markings ............................................................................................................ 44
3.9
Processor Land Coordinates .............................................................................................. 45
4
Land Listing and Signal Descriptions...........................................................................47
4.1
Processor Land Assignments ............................................................................................. 47
4.2
Alphabetical Signals Reference .......................................................................................... 70
5
Thermal Specifications and Design Considerations ..............................................79
5.1
Processor Thermal Specifications ...................................................................................... 79
5.1.1
Thermal Specifications .......................................................................................... 79
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