- 您现在的位置：买卖IC网 > PDF目录298893 > BX80552661 (INTEL CORP) 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775 PDF资料下载
参数资料
| 型号： | BX80552661 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 45/108页 |
| 文件大小： | 3283K |
| 代理商： | BX80552661 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页当前第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页
Datasheet
43
Package Mechanical Specifications
3.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-out zone
requirements. A thermal and mechanical solution design must not intrude into the required keep-
out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the
package substrate. See Figure 3-2 and Figure 3-3 for keep-out zones. The location and quantity of
package capacitors may change due to manufacturing efficiencies but will remain within the
component keep-in.
3.3
Package Loading Specifications
Table 3-1 provides dynamic and static load specifications for the processor package. These
mechanical maximum load limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Also, any mechanical system or component testing should
not exceed the maximum limits. The processor package substrate should not be used as a
mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum
loading specification must be maintained by any thermal and mechanical solutions.
.
NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the
minimum specified load on the processor package.
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package only and do not include the limits of the processor socket.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.
3.4
Package Handling Guidelines
Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal.
NOTES:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization.
Table 3-1. Processor Loading Specifications
Parameter
Minimum
Maximum
Notes
Static
80 N [17 lbf]
311 N [70 lbf]
1, 2, 3
Dynamic
—
756 N [170 lbf]
1, 3, 4
Table 3-2. Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
311 N [70 lbf]
1, 4
Tensile
111 N [25 lbf]
2, 4
Torque
3.95 N-m [35 lbf-in]
3, 4
相关PDF资料 |
PDF描述 |
|---|---|
| BX80552651T2 | 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775 |
| BX80552641T | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| BX80552641T2 | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| BX805555060P | 64-BIT, MICROPROCESSOR, BGA771 |
| BX805555080P | 64-BIT, MICROPROCESSOR, BGA771 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80552661T2 | 制造商:Intel 功能描述:P4 661 3.6GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80553915 S L9KB | 制造商:Intel 功能描述: |
| BX80553915R S L9DA | 制造商:Intel 功能描述: |
| BX80553925 S L9KA | 制造商:Intel 功能描述: |
| BX80553945 S L9QQ | 制造商:Intel 功能描述:PENTIUM D PROCESSOR 945 |
发布紧急采购，3分钟左右您将得到回复。