参数资料
型号: BX80552661
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775
封装: FLIP CHIP, LGA-775
文件页数: 16/108页
文件大小: 3283K
代理商: BX80552661
Datasheet
17
Electrical Specifications
2
Electrical Specifications
This chapter describes the electrical characteristics of the processor interfaces and signals. DC
electrical characteristics are provided.
2.1
Power and Ground Lands
The Pentium 4 processor has 226 VCC (power), 24 VTT and 273 VSS (ground) inputs for on-chip
power distribution. All power lands must be connected to V
CC, while all VSS lands must be
connected to a system ground plane. The processor VCC lands must be supplied the voltage
determined by the Voltage IDentification (VID) lands.
Twenty-four (24) signals are denoted as VTT, that provide termination for the front side bus and
power to the I/O buffers. A separate supply must be implemented for these lands, that meets the
VTT specifications outlined in Table 2-3.
2.2
Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is capable of
generating large current swings. This may cause voltages on power planes to sag below their
minimum specified values if bulk decoupling is not adequate. Larger bulk storage (C
BULK), such as
electrolytic or aluminum-polymer capacitors, supply current during longer lasting changes in
current demand by the component, such as coming out of an idle condition. Similarly, they act as a
storage well for current when entering an idle condition from a running condition. The
motherboard must be designed to ensure that the voltage provided to the processor remains within
the specifications listed in Table 2-3. Failure to do so can result in timing violations or reduced
lifetime of the component.
2.2.1
VCC Decoupling
VCC regulator solutions need to provide sufficient decoupling capacitance to satisfy the processor
voltage specifications. This includes bulk capacitance with low effective series resistance (ESR) to
keep the voltage rail within specifications during large swings in load current. In addition, ceramic
decoupling capacitors are required to filter high frequency content generated by the front side bus
and processor activity. Consult the Voltage Regulator-Down (VRD) 10.1 Design Guide For
Desktop and Transportable LGA775 Socket for further information.
2.2.2
VTT Decoupling
Decoupling must be provided on the motherboard. Decoupling solutions must be sized to meet the
expected load. To insure compliance with the specifications, various factors associated with the
power delivery solution must be considered including regulator type, power plane and trace sizing,
and component placement. A conservative decoupling solution would consist of a combination of
low ESR bulk capacitors and high frequency ceramic capacitors.
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