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Datasheet
103
Balanced Technology Extended (BTX) Boxed Processor Specifications
Design Requirements Document, Balanced Technology Extended (BTX) System Design Guide, and
the Intel Pentium D Processor, Intel Pentium Processor Extreme Edition, and Intel
Pentium 4 Processor Thermal and Mechanical Design Guidelines for more detailed information
regarding the support and retention module and chassis interface and keepout zones.
Figure 8-5illustrates the assembly stack including the SRM.
8.2
Electrical Requirements
8.2.1
Thermal Module Assembly Power Supply
The boxed processor's Thermal Module Assembly (TMA) requires a +12 V power supply. The
TMA will include power cable to power the integrated fan and will plug into the 4-wire fan header
on the baseboard. The power cable connector and pinout are shown in
Figure 8-6. Baseboards must
provide a compatible power header to support the boxed processor.
Table 8-1contains
specifications for the input and output signals at the TMA.
The TMA outputs a SENSE signal, which is an open- collector output that pulses at a rate of 2
pulses per fan revolution. A baseboard pull-up resistor provides VOH to match the system board-
mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the
SENSE signal is not used, pin 3 of the connector should be tied to GND.
Figure 8-5. Assembly Stack Including the Support and Retention Module
T herm a l M odu le A ssem bly
H ea tsin k & F an
C lip
S tructural D uct
M othe rboard
SR M
Cha ssis Pan