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参数资料
| 型号： | BX80552661 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 6/108页 |
| 文件大小： | 3283K |
| 代理商： | BX80552661 |
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Datasheet
105
Balanced Technology Extended (BTX) Boxed Processor Specifications
8.3
Thermal Specifications
This section describes the cooling requirements of the thermal module assembly solution used by
the boxed processor.
8.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a TMA. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor case temperature specification
is in Chapter 5. The boxed processor TMA is able to keep the processor temperature within the
specifications Table for chassis that provide good thermal management. For the boxed processor
TMA to operate properly, it is critical that the airflow provided to the TMA is unimpeded. Airflow
of the TMA is into the duct and out of the rear of the duct in a linear flow. Blocking the airflow to
the TMA inlet reduces the cooling efficiency and decreases fan life. Filters will reduce or impede
airflow which will result in a reduced performance of the TMA. The air temperature entering the
fan should be kept below 35.5°C. Again, meeting the processor's temperature specification is the
responsibility of the system integrator.
Figure 8-7. Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched
Area)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80552661T2 | 制造商:Intel 功能描述:P4 661 3.6GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80553915 S L9KB | 制造商:Intel 功能描述: |
| BX80553915R S L9DA | 制造商:Intel 功能描述: |
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