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参数资料
| 型号： | DC1663A |
| 厂商： | Linear Technology |
| 文件页数： | 22/36页 |
| 文件大小： | 0K |
| 描述： | DEMO BOARD LTM4628 |
| 软件下载： | LTM4628 Spice Model |
| 设计资源： | LTM4628 Gerber Files DC1663A Design Files |
| 标准包装： | 1 |
| 系列： | µModule® |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 2，非隔离 |
| 输出电压： | 1.2V，1.5V |
| 电流 - 输出： | 8A，8A |
| 输入电压： | 4.5 ~ 26.5 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 400kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM4628 |
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LTM4628
APPLICATIONS INFORMATION
The 1.0V and 3.3V power loss curves in Figures 11 and 12
can be used in coordination with the load current derating
curves in Figures 13 to 24 for calculating an approximate
θ JA thermal resistance for the LTM4628 with various heat
sinking and airflow conditions. The power loss curves are
taken at room temperature, and are increased with mul-
tiplicative factors according to the ambient temperature.
The approximate factors are: 1.35 for 115°C and 1.4 for
120°C. The derating curves are plotted with V OUT1 and
V OUT2 in parallel single output operation starting at 16A
and the ambient temperature at 40°C. The output volt-
ages are 1.0V, and 3.3V. These are chosen to include the
lower and higher output voltage ranges for correlating
the thermal resistance. Thermal models are derived from
several temperature measurements in a controlled tem-
perature chamber along with thermal modeling analysis.
The junction temperatures are monitored while ambi-
ent temperature is increased with and without airflow.
The power loss increase with ambient temperature change
is factored into the derating curves. The junctions are
maintained at 115°C to 120°C maximum while lowering
output current or power with increasing ambient tem-
perature. The decreased output current will decrease the
internal module loss as ambient temperature is increased.
The monitored junction temperature of 120°C minus
the ambient operating temperature specifies how much
temperature rise can be allowed. As an example, in
Figure 14 the load current is derated to ~12A at ~80°C with
no air or heat sink and the power loss for the 12V to 1.0V
at 12A output is about 3.65W. The 3.65W loss is calculated
with the ~2.7W room temperature loss from the 12V to
1.0V power loss curve at 12A, and the 1.35 multiplying
factor at 120°C junction. If the 80°C ambient tempera-
ture is subtracted from the 120°C junction temperature,
then the difference of 40°C divided by 3.65W equals a
10.9°C/W θ JA thermal resistance. Table 2 specifies a
9.5°C/W to 10°C/W value which is very close. Table 2 and
Table 3 provide equivalent thermal resistances for 1.0V and
3.3V outputs with and without airflow and heat sinking.
The derived thermal resistances in Tables 2 and 3 for the
various conditions can be multiplied by the calculated
power loss as a function of ambient temperature to derive
temperature rise above ambient, thus maximum junction
temperature. The no-airflow θ JA values have some variation
from 9.5°C/W to 11°C/W depending on the 115°C to 120°C
holding junction temperature. All other airflow thermal
resistance values are more accurate. Room temperature
power loss can be derived from the efficiency curves in
the Typical Performance Characteristics section and ad-
justed with the above ambient temperature multiplicative
factors. The printed circuit board is a 1.6mm thick four
layer board with two ounce copper for the two outer layers
and one ounce copper for the two inner layers. The PCB
dimensions are 95mm × 76mm. The BGA heat sinks are
listed in Table 3.
4628fe
22
For more information www.linear.com/LTM4628
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