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参数资料
| 型号： | DC1663A |
| 厂商： | Linear Technology |
| 文件页数： | 28/36页 |
| 文件大小： | 0K |
| 描述： | DEMO BOARD LTM4628 |
| 软件下载： | LTM4628 Spice Model |
| 设计资源： | LTM4628 Gerber Files DC1663A Design Files |
| 标准包装： | 1 |
| 系列： | µModule® |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 2，非隔离 |
| 输出电压： | 1.2V，1.5V |
| 电流 - 输出： | 8A，8A |
| 输入电压： | 4.5 ~ 26.5 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 400kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM4628 |
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LTM4628
APPLICATIONS INFORMATION
Safety Considerations
The LTM4628 modules do not provide galvanic isolation
from V IN to V OUT . There is no internal fuse. If required,
a slow blow fuse with a rating twice the maximum input
current needs to be provided to protect each unit from
catastrophic failure. The device does support thermal
shutdown and over current protection. A temperature
diode is provided for monitoring internal temperature.
Layout Checklist/Example
The high integration of LTM4628 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
? Use large PCB copper areas for high current paths,
including V IN , GND, V OUT1 and V OUT2 . It helps to mini-
mize the PCB conduction loss and thermal stress.
? Place high frequency ceramic input and output capaci-
tors next to the V IN , PGND and V OUT pins to minimize
high frequency noise.
C IN1
M
L
K
V IN
? Place a dedicated power ground layer underneath the
unit.
? To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
? Do not put via directly on the pad, unless they are
capped or plated over.
? Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
? For parallel modules, tie the V OUT , V FB , and COMP pins
together. Use an internal layer to closely connect these
pins together. The TRACK pin can be tied a common
capacitor for regulator soft-start.
? Bring out test points on the signal pins for monitoring.
Figure 27 gives a good example of the recommended
layout. LGA and BGA PCB layouts are identical with the
exception of circle pads for BGA (see Package Description).
C IN2
GND
C OUT1
J
H
G
F
E
D
C
B
A
GND
C OUT2
SGND
1
2
3
4
5
6
7
8
9
10
11
12
V OUT1
CNTRL
GND
CNTRL
V OUT2
4628 F27
Figure 27. Recommended PCB Layout (LGA Shown, for BGA Use Circle Pads)
4628fe
28
For more information www.linear.com/LTM4628
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