参数资料
型号: E28F200BX-T120
厂商: INTEL CORP
元件分类: PROM
英文描述: 2-MBIT (128K x 16, 256K x 8) BOOT BLOCK FLASH MEMORY FAMILY
中文描述: 128K X 16 FLASH 12V PROM, 120 ns, PDSO56
封装: 20 X 14 MM, TSOP-56
文件页数: 24/48页
文件大小: 453K
代理商: E28F200BX-T120
28F200BX-TB 28F002BX-TB
DC CHARACTERISTICS (Continued)
Symbol
Parameter
Notes
Min
Typ Max Unit
Test Condition
VOH1
Output High Voltage (TTL)
24
V
VCC e VCC Min
IOH eb25 mA
VOH2
Output High Voltage (CMOS)
085 VCC
VVCC e VCC Min
IOH eb25 mA
VCC b 04
VCC e VCC Min
IOH eb100 mA
VPPL
VPP during Normal Operations
3
00
65
V
VPPH
VPP during EraseWrite Operations
7
114
120 126
V
VPPH
VPP during EraseWrite Operations
8
108
120 132
V
VLKO
VCC EraseWrite Lock Voltage
20
V
VHH
RP
Unlock Voltage
115
130
V
Boot Block WriteErase
NOTES
1 All currents are in RMS unless otherwise noted Typical values at VCC e 50V VPP e 120V T e 25 C These currents
are valid for all product versions (packages and speeds)
2 ICCES is specified with the device deselected If the device is read while in Erase Suspend Mode current draw is the sum
of ICCES and ICCR
3 Block Erases and WordByte Writes are inhibited when VPP e VPPL and not guaranteed in the range between VPPH and
VPPL
4 Sampled not 100% tested
5 Automatic Power Savings (APS) reduces ICCR to less than 1 mA typical in static operation
6 CMOS Inputs are either VCC g02V or GND g02V TTL Inputs are either VIL or VIH
7 VPP e 120V g5% for applications requiring 100000 block erase cycles
8 VPP e 120V g10% for applications requiring wider VPP tolerances at 100 block erase cycles
9 For the 28F002BX address pin A10 follows the COUT capacitance numbers
10 ICCR typical is 25 mA for X16 active read current
EXTENDED TEMPERATURE OPERATING CONDITIONS
Symbol
Parameter
Notes
Min
Max
Units
TA
Operating Temperature
b
40
a
85
C
VCC
VCC Supply Voltage (10%)
5
450
550
V
30
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