参数资料
型号: FGH50N6S2D
厂商: Fairchild Semiconductor
文件页数: 2/9页
文件大小: 0K
描述: IGBT N-CHAN 600V 75A TO-247
产品培训模块: High Voltage Switches for Power Processing
SMPS Power Switch
产品变化通告: Lead Frame Change 20/Dec/2007
产品目录绘图: IGBT TO-247 Package
标准包装: 150
电压 - 集电极发射极击穿(最大): 600V
Vge, Ic时的最大Vce(开): 2.7V @ 15V,30A
电流 - 集电极 (Ic)(最大): 75A
功率 - 最大: 463W
输入类型: 标准
安装类型: 通孔
封装/外壳: TO-247-3
供应商设备封装: TO-247
包装: 管件
产品目录页面: 1610 (CN2011-ZH PDF)
其它名称: FGH50N6S2D_NL
FGH50N6S2D_NL-ND
Package Marking and Ordering Information
Device Marking
50N6S2D
Device
FGH50N6S2D
Package
TO-247
Tape Width
N/A
Quantity
30
Electrical Characteristics T J = 25 ° C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off State Characteristics
BV CES
Collector to Emitter Breakdown Voltage I C = 250 μ A, V GE = 0
600
-
-
V
I CES
Collector to Emitter Leakage Current
V CE = 600V
T J = 25 ° C
-
-
250
μ A
T J = 125 ° C
-
-
2.8
mA
I GES
Gate to Emitter Leakage Current
V GE = ± 20V
-
-
±250
nA
On State Characteristics
V CE(SAT) Collector to Emitter Saturation Voltage
I C = 30A,
V GE = 15V
T J = 25 ° C
T J = 125 ° C
-
-
1.9
1.7
2.7
2.2
V
V
V EC
Diode Forward Voltage
I EC = 30A
-
2.2
2.6
V
Dynamic Characteristics
Q G(ON)
Gate Charge
I C = 30A,
V CE = 300V
V GE = 15V
V GE = 20V
-
-
70
90
85
110
nC
nC
V GE(TH)
V GEP
Gate to Emitter Threshold Voltage
Gate to Emitter Plateau Voltage
I C = 250 μ A, V CE = V GE
I C = 30A, V CE = 300V
3.5
-
4.3
6.5
5.0
8.0
V
V
Switching Characteristics
SSOA
t d(ON)I
t rI
t d(OFF)I
t fI
E ON1
E ON2
E OFF
t d(ON)I
t rI
t d(OFF)I
t fI
E ON1
E ON2
E OFF
t rr
Switching SOA
Current Turn-On Delay Time
Current Rise Time
Current Turn-Off Delay Time
Current Fall Time
Turn-On Energy (Note 2)
Turn-On Energy (Note 2)
Turn-Off Energy (Note 3)
Current Turn-On Delay Time
Current Rise Time
Current Turn-Off Delay Time
Current Fall Time
Turn-On Energy (Note 2)
Turn-On Energy (Note 2)
Turn-Off Energy (Note 3)
Diode Reverse Recovery Time
T J = 150 ° C, V GE = 15V, R G = 3 ?
L = 100 μ H, V CE = 600V
IGBT and Diode at T J = 25 ° C,
I CE = 30A,
V CE = 390V,
V GE = 15V,
R G = 3 ?
L = 200 μ H
Test Circuit - Figure 26
IGBT and Diode at T J = 125 ° C
I CE = 30A,
V CE = 390V,
V GE = 15V,
R G = 3 ?
L = 200 μ H
Test Circuit - Figure 26
I EC = 30A, dI EC /dt = 200A/ μ s
I EC = 1A, dI EC /dt = 200A/ μ s
150
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
13
15
55
50
260
330
250
13
15
92
88
260
490
575
50
30
-
-
-
-
-
-
-
350
-
-
150
100
-
600
850
55
42
A
ns
ns
ns
ns
μ J
μ J
μ J
ns
ns
ns
ns
μ J
μ J
μ J
ns
ns
Thermal Characteristics
R θ JC
Thermal Resistance Junction-Case
IGBT
Diode
-
-
-
-
0.27
1.1
° C/W
° C/W
NOTE:
2. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E ON1 is the turn-on loss
of the IGBT only. E ON2 is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same T J
as the IGBT. The diode type is specified in figure 26.
3. Turn-Off Energy Loss (E OFF ) is defined as the integral of the instantaneous power loss starting at the trailing edge of
the input pulse and ending at the point where the collector current equals zero (I CE = 0A). All devices were tested per
JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produc-
es the true total Turn-Off Energy Loss.
?2002 Fairchild Semiconductor Corporation
FGH50N6S2D RevA2
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