参数资料
型号: FGH50N6S2D
厂商: Fairchild Semiconductor
文件页数: 6/9页
文件大小: 0K
描述: IGBT N-CHAN 600V 75A TO-247
产品培训模块: High Voltage Switches for Power Processing
SMPS Power Switch
产品变化通告: Lead Frame Change 20/Dec/2007
产品目录绘图: IGBT TO-247 Package
标准包装: 150
电压 - 集电极发射极击穿(最大): 600V
Vge, Ic时的最大Vce(开): 2.7V @ 15V,30A
电流 - 集电极 (Ic)(最大): 75A
功率 - 最大: 463W
输入类型: 标准
安装类型: 通孔
封装/外壳: TO-247-3
供应商设备封装: TO-247
包装: 管件
产品目录页面: 1610 (CN2011-ZH PDF)
其它名称: FGH50N6S2D_NL
FGH50N6S2D_NL-ND
Typical Performance Curves
75
T J = 25 ° C unless otherwise noted
200
60
45
DUTY CYCLE < 0.5%,
PULSE DURATION = 250 μ s
175
150
125
d I EC /dt = 200A/ μ s, V CE = 390V
125 o C t rr
125 o C
100
125 o C t b
30
25 o C
75
50
25 o C t a, t b
25 o C t r r
15
25
0
0
125 o C t a
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
2
6
10
14
18
22
26
30
V EC , FORWARD VOLTAGE (V)
Figure 19. Diode Forward Current vs Forward
Voltage Drop
I EC , FORWARD CURRENT (A)
Figure 20. Recovery Times vs Forward Current
150
I EC = 30A, V CE = 390V
1200
V CE = 390V
125 o C, I EC = 30A
125
1000
100
75
50
125 o C t a
125 o C t b
800
600
400
125 o C, I EC = 15A
25 o C, I EC = 30A
25 o C t a
25
0
25 o C t b
200
0
25 o C, I EC = 15A
200
400
600
800
1000
1200
200
400
600
800
1000
1200
dI EC /dt, RATE OF CHANGE OF CURRENT (A/ μ s)
Figure 21. Recovery Times vs Rate of Change of
Current
3.0
dI EC /dt, RATE OF CHANGE OF CURRENT (A/ μ s)
Figure 22. Stored Charge vs Rate of Change of
Current
30
2.5
V CE = 390V, T J = 125 ° C
25
V CE = 390V, T J = 125 ° C
I EC = 30A
I EC = 30A
2.0
20
1.5
I EC = 15A
I EC = 15A
15
1.0
0.5
0
10
5
200
400
600
800
1000
1200
200
400
600
800
1000
1200
dI EC /dt, CURRENT RATE OF CHANGE (A/ μ s)
Figure 23. Reverse Recovery Softness Factor vs
Rate of Change of Current
?2002 Fairchild Semiconductor Corporation
dI EC /dt, CURRENT RATE OF CHANGE (A/ μ s)
Figure 24. Maximum Reverse Recovery Current vs
Rate of Change of Current
FGH50N6S2D RevA2
相关PDF资料
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