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参数资料
| 型号： | HSP50415VIZ |
| 厂商： | Intersil |
| 文件页数： | 29/29页 |
| 文件大小： | 0K |
| 描述： | IC MODULATOR PROGRAMABLE 100MQFP |
| 标准包装： | 66 |
| 功能： | 调制器 |
| 封装/外壳： | 100-BQFP |
| 包装： | 托盘 |
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HSP50415
Metric Plastic Quad Flatpack Packages (MQFP)
D
D1
-D-
Q100.14x20 (JEDEC MS-022GC-1 ISSUE B)
100 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
INCHES
MILLIMETERS
SYMBOL
A
A1
MIN
-
0.010
MAX
0.134
-
MIN
-
0.25
MAX
3.40
-
NOTES
-
-
E E1
-A-
-B-
e
A2
b
b1
D
D1
E
E1
L
0.101
0.009
0.009
0.908
0.782
0.673
0.547
0.029
0.113
0.015
0.013
0.918
0.792
0.681
0.555
0.040
2.57
0.22
0.22
23.08
19.88
17.10
13.90
0.73
2.87
0.38
0.33
23.32
20.12
17.30
14.10
1.03
-
6
-
3
4, 5
3
4, 5
-
PIN 1
N
100
100
7
-H-
A
SEATING
PLANE
0.076
e
ND
NE
0.026 BSC
30
20
0.65 BSC
30
20
-
-
-
0.40
0.016 MIN
12 o -16 o
0.20
0.008
M
C A-B S
-C-
D S
0.003
Rev. 1 4/99
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
0 o MIN
b
dimensions are not necessarily exact.
0 o -7 o
L
A2 A1
12 o -16 o
0.13/0.17
0.005/0.007
BASE METAL
WITH PLATING
b1
0.13/0.23
0.005/0.009
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total.
7. “N” is the number of terminal positions.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
29
FN4559.6
April 23, 2007
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