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| 型号： | IBM25PPC750CX-CP40-3T |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 466 MHz, RISC PROCESSOR, PBGA256 |
| 封装： | PLASTIC, BGA-256 |
| 文件页数： | 26/43页 |
| 文件大小： | 509K |
| 代理商： | IBM25PPC750CX-CP40-3T |
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PowerPC 750CX RISC Microprocessor Datasheet
Page 32
Version 1.2
Jun 20, 2001
7.5
Output Buffer DC Impedance
The PowerPC 750CX 60X drivers were characterized over various process, voltage, and temperature conditions. To
measure Z0, an external resistor is connected to the chip pad, either to OVDD or GND. Then the value of the resistor is
varied until the pad voltage is OV
DD/2; see Figure 16 below.
The output impedance is actually the average of two resistances: the resistance of the pull-up and the resistance of pull-
down devices. When Data is held low, SW1 is closed (SW2 is open), and R
N is trimmed until Pad = OVDD/2. RN then
becomes the resistance of the pull-down devices. When Data is held high, SW2 is closed (SW1 is open), and R
P is
trimmed until Pad = OV
DD/2. RP then becomes the resistance of the pull-up devices. With a properly designed driver RP
and R
N are close to each other in value, then Z0 = (RP + RN)/2.
The following table summarizes the impedance a board designer would design to for a typical process.
Figure 16. Driver Impedance Measurement
Table 15: Driver Impedance Characteristics
Process
60XImpedance (
)
VDD, OVDD (V)
Temperature (C)
Worst
65
1.70
105
Typical
50
1.8
65
Best
40
1.90
0
Worst
65
2.38
105
Typical
50
2.5
65
Best
40
2.62
0
Data
OV
DD
R
N
SW2
SW1
Pad
R
P
GND
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