参数资料
型号: MA28140
厂商: Dynex Semiconductor Ltd.
英文描述: Packet Telecommand Decoder
中文描述: 包遥控解码器
文件页数: 14/72页
文件大小: 857K
代理商: MA28140
MA28140
14/72
Buffer Management
Once the data is validated (Clean, Legal and Frame
Validation processes passed), it is transferred from the front-
end buffer to the back-end buffer for use by the segmentation
layer. Only one back-end buffer is managed by the PTD. This
mechanism is depicted in figure 6 below:
Figure 6: Buffer Management
FRONT END BUFFER
Segment n
Segment n-1
Coding and
Transfer
Layers
Segmentation Layer
CPDU
BACK END BUFFER
Segment n-1
CPDU BUFFER
Applications
CPDU I/F
N Segment Reception
BACK END BUFFER
Segment n
Segment n+1
Coding and
Transfer
Layers
Segmentation Layer
CPDU
FRONT END BUFFER
Segment n
CPDU BUFFER
Applications
CPDU I/F
N+1 Segment Reception
相关PDF资料
PDF描述
MA28151 Radiation hard Programmable Communication Interface
MA28155 Radiation Hard Programmable Peripheral Interface
MA31750 High Performance MIL-STD-1750 Microprocessor
MA31751 Memory Management & Block Protection Unit
MA31753 DMA Controller (DMAC) For An MA31750 System
相关代理商/技术参数
参数描述
MA28150FBB 功能描述:专用陶瓷电容器 HF CHIP RoHS:否 制造商:Panasonic Electronic Components 电容:470 pF 容差:10 % 电压额定值:250 VAC 工作温度范围:- 25 C to + 125 C 端接类型:SMD/SMT 外壳代码 - in: 外壳代码 - mm:
MA28150FBN 功能描述:专用陶瓷电容器 HF CHIP RoHS:否 制造商:Panasonic Electronic Components 电容:470 pF 容差:10 % 电压额定值:250 VAC 工作温度范围:- 25 C to + 125 C 端接类型:SMD/SMT 外壳代码 - in: 外壳代码 - mm:
MA28150GBB 功能描述:专用陶瓷电容器 HF CHIP RoHS:否 制造商:Panasonic Electronic Components 电容:470 pF 容差:10 % 电压额定值:250 VAC 工作温度范围:- 25 C to + 125 C 端接类型:SMD/SMT 外壳代码 - in: 外壳代码 - mm:
MA28150GBN 功能描述:专用陶瓷电容器 HF CHIP RoHS:否 制造商:Panasonic Electronic Components 电容:470 pF 容差:10 % 电压额定值:250 VAC 工作温度范围:- 25 C to + 125 C 端接类型:SMD/SMT 外壳代码 - in: 外壳代码 - mm:
MA28150JAB 功能描述:专用陶瓷电容器 HF CHIP RoHS:否 制造商:Panasonic Electronic Components 电容:470 pF 容差:10 % 电压额定值:250 VAC 工作温度范围:- 25 C to + 125 C 端接类型:SMD/SMT 外壳代码 - in: 外壳代码 - mm: