参数资料
型号: MPM22CGA800A
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 800 MHz, MICROPROCESSOR, XMA
封装: MMC-2
文件页数: 19/68页
文件大小: 966K
代理商: MPM22CGA800A
Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep Technology
20
Datasheet
243356-006
Figure 2. MMC-2 Connector Pad Footprint
Table 13 summarizes some of the key connector specifications.
400-Pin Connector Footprint
OEM Pad Assignments
40
1
K
A
Table 13. Connector Specifications
Parameter
Condition
Specification
Material
Contact
Copper Alloy
Housing
Thermo-Plastic Molded Compound: LCP
Electrical
Current
0.5A
Voltage
50 VAC
Insulation Resistance
100 M
Termination Resistance
20-m
maximum at 20-mV open circuit with 10 mA
Capacitance
5-pF maximum per contact
Mechanical
Mating Cycles
50 cycles
Connector Mating Force
50-lbs (22.7 kg) maximum
Contact Unmating Force
30-lbs (13.6 kg) maximum
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