参数资料
型号: MPM22CGA800A
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 800 MHz, MICROPROCESSOR, XMA
封装: MMC-2
文件页数: 62/68页
文件大小: 966K
代理商: MPM22CGA800A
Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep Technology
243356-006
Datasheet
59
7.0
Thermal Specification
7.1
Thermal Design Power
Table 31 provides the typical thermal design power (TDP) specifications. The typical TDP is the
typical power dissipation under normal operating conditions at nominal V_CORE (CPU power
supply) while executing the worst case power instruction mix. This includes the power dissipated
by all of the relevant components. During all operating environments, the processor junction
temperature, Tj, must be within the specified range of 0
° C to 100 ° C.
The power handling capability of the system thermal solution may be reduced to less than the
recommended typical TDP with the implementation of firmware/software control or "throttling”
that reduces the CPU power consumption and dissipation.
NOTES:
1. The processor temperature, Tj, must be within the special range of 0 °C to 100°C.
2. TDPModule is a thermal-solution design reference point for the system thermal solution readiness for total
module power.
3. Module equals core + 82443BX + VR.
Table 31. Thermal Design Power (TDPMODULE) Specification
Typical
850/700 MHz
Typical
800/650 MHz
Typical
750/600 MHz
Typical
700/550 MHz
Typical
650/500 MHz
Typical
600/500 MHz
1.60V
1.35V
1.60V
1.35V
1.60V
1.35V
1.60V
1.35V
1.60V
1.35V
1.60V
1.35V
22.5
15.1
21.6
14.6
20.0W
13.9W
19.1W
13.4W
17.8W
12.2W
16.6W
12.2W
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