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参数资料
| 型号： | MPM22CGA800A |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 800 MHz, MICROPROCESSOR, XMA |
| 封装： | MMC-2 |
| 文件页数： | 66/68页 |
| 文件大小： | 966K |
| 代理商： | MPM22CGA800A |
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Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep Technology
243356-006
Datasheet
1
1.0
Introduction
This document provides the technical specifications for integrating the Intel Pentium III processor
mobile module with Intel SpeedStep technology connector 2 (MMC-2) into the latest notebook
systems for today’s notebook market.
Building around this design gives the system manufacturer these advantages:
Avoids complexities associated with designing high-speed processor core logic boards.
A standard interface provides an upgrade path from previous Intel mobile modules.
1.1
References
Refer to the following documents for additional information relating to the Pentium III processor
mobile module with featuring Intel SpeedStep technology.
Mobile Pentium III Processor in BGA2 and Micro-PGA2 Packages Datasheet (Order
Number 245302)
Intel 440BX AGPSet: 82443BX Host Bridge/Controller Datasheet (Order Number: 290633-
001)
82371AB PCI-to-ISA/IDE Xcelerator (PIIX4) (Order Number: 290562-001)
Intel 82371MB (PIIX4E/M) Specification Update
CK97 Clock Synthesizer/Driver Specification (OR-1089)
IntelPentium III Processor Mobile Module MMC-2 Simulation and Validation Kit Rev. 2.0
(OR-1781)
Intel Pentium III Processor Mobile Module System Electronics 100-MHz Layout Guidelines
Rev. 1.0 (OR-1780)
Mobile Pentium III Processor/440BX AGPset Recommended Design and Debug Practices
(RDDP-A) 100 MHz Rev. 2.0 (SC-2760)
66/100MHz PC SDRAM Unbuffered SO-DIMM Specification Rev 1.0
Intel Mobile Module Design Guide (AP-590)
Pentium II Processor Mobile Module MMC-2 Insertion & Extraction User Manual Rev 1.0
Mobile Pentium II Processor Mobile Module 400-Pin BGA Connector Assembly
Development Guide Rev. 1.0*
Focused Discussion on Intel Mobile Modules Design for Mfg. & Best Methods for MHPG
Customers Rev. 1.0 (OR-1385)
EMI Design Guide (ORMD6-0859)
Intel Mobile Module Newsletters
Intel Mobile Module Thermal Diode Temperature Sensor Application Note
Geyserville Hardware Technical Specification, Revision 2.0 (OR-1728)
Geyserville Software Architecture Specification, Revision 1.5 (SC-2364)
Intel MMC-2 Standoff/Receptacle Height Spreadsheet
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPM-25S | 制造商:MPD 制造商全称:MicroPower Direct, LLC 功能描述:Universal Input, 25W Miniature, PC Mount AC/DC Power Supplies |
| MPM-25S-05 | 制造商:MPD 制造商全称:MicroPower Direct, LLC 功能描述:Universal Input, 25W Miniature, PC Mount AC/DC Power Supplies |
| MPM-25S-12 | 制造商:MPD 制造商全称:MicroPower Direct, LLC 功能描述:Universal Input, 25W Miniature, PC Mount AC/DC Power Supplies |
| MPM-25S-15 | 制造商:MPD 制造商全称:MicroPower Direct, LLC 功能描述:Universal Input, 25W Miniature, PC Mount AC/DC Power Supplies |
| MPM-25S-24 | 制造商:MPD 制造商全称:MicroPower Direct, LLC 功能描述:Universal Input, 25W Miniature, PC Mount AC/DC Power Supplies |
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