参数资料
型号: MT47H64M8B6-3ELAT:D
元件分类: DRAM
英文描述: DDR DRAM, PBGA60
封装: 10 X 10 MM, ROHS COMPLIANT, FBGA-60
文件页数: 54/139页
文件大小: 9398K
Figure 9: 84-Ball FBGA (10mm x 12.5mm) – x16
Ball A1 ID location
1.20 MAX
Ball A1 ID
0.8
TYP
0.8 TYP
6.4
10.0 ±0.15
Solder ball diameter
refers to post reflow
condition.
84X 0.45
11.2
12.5 ±0.15
CL
0.8 ±0.1
Seating plane
C
0.12 C
0.25 MIN
Note: 1. All dimensions are in millimeters.
512Mb: x4, x8, x16 DDR2 SDRAM
Packaging
PDF: 09005aef82f1e6e2
Rev. N 1/09 EN
21
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
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