参数资料
型号: NAND01GR3B3CZA1
厂商: STMICROELECTRONICS
元件分类: PROM
英文描述: 128M X 8 FLASH 1.8V PROM, 35 ns, PBGA63
封装: 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63
文件页数: 17/59页
文件大小: 998K
代理商: NAND01GR3B3CZA1
NAND512-B, NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B
24/59
Copy Back Program
The Copy Back Program operation is used to copy
the data stored in one page and reprogram it in an-
other page.
The Copy Back Program operation does not re-
quire external memory and so the operation is
faster and more efficient because the reading and
loading cycles are not required. The operation is
particularly useful when a portion of a block is up-
dated and the rest of the block needs to be copied
to the newly assigned block.
If the Copy Back Program operation fails an error
is signalled in the Status Register. However as the
standard external ECC cannot be used with the
Copy Back Program operation bit error due to
charge loss cannot be detected. For this reason it
is recommended to limit the number of Copy Back
Program operations on the same data and or to
improve the performance of the ECC.
The Copy Back Program operation requires four
steps:
1.
The first step reads the source page. The
operation copies all 1056 Words/ 2112 Bytes
from the page into the Data Buffer. It requires:
one bus write cycle to setup the command
4 bus write cycles to input the source page
address
one bus write cycle to issue the confirm
command code
2.
When the device returns to the ready state
(Ready/Busy High), the next bus write cycle of
the command is given with the 4 bus cycles to
input the target page address. Refer to Table
11. for the addresses that must be the same
for the Source and Target pages.
3.
Then the confirm command is issued to start
the P/E/R Controller.
The Data Input cycle for modifying the source
page is performed as shown in Figure 14. After a
Copy Back Program operation, a partial-page pro-
gram is not allowed in the target page until the
block has been erased.
See Figure 14. for an example of the Copy Back
Program operation.
A data input cycle to modify a portion or a multiple
distant portion of the source page, is shown in Fig-
Table 11. Copy Back Program x8 Addresses
Note: 1. DD = Dual Die, QD = Quadruple Die.
Table 12. Copy Back Program x16 Addresses
Note: 1. DD = Dual Die, QD = Quadruple Die.
Density
Same Address for Source and
Target Pages
512 Mbit
no constraint
1 Gbit
no constraint
2 Gbit DD(1)
A28
2 Gbit
no constraint
4 Gbit DD
A29
8 Gbit QD(1)
A29,A30
Density
Same Address for Source and
Target Pages
512 Mbit
no constraint
1 Gbit
no constraint
2 Gbit DD(1)
A27
2 Gbit
no constraint
4 Gbit DD(1)
A28
8 Gbit QD(1)
A28,A29
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NAND01GR3M0AZB5E 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP
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NAND01GR3M0AZC5E 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP
NAND01GR3M0AZC5F 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP
NAND01GR3M0BZB5E 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP