参数资料
型号: NAND01GR3B3CZA1
厂商: STMICROELECTRONICS
元件分类: PROM
英文描述: 128M X 8 FLASH 1.8V PROM, 35 ns, PBGA63
封装: 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63
文件页数: 30/59页
文件大小: 998K
代理商: NAND01GR3B3CZA1
NAND512-B, NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B
36/59
SOFTWARE ALGORITHMS
This section gives information on the software al-
gorithms that ST recommends to implement to
manage the Bad Blocks and extend the lifetime of
the NAND device.
NAND Flash memories are programmed and
erased by Fowler-Nordheim tunneling using a high
voltage. Exposing the device to a high voltage for
extended periods can cause the oxide layer to be
damaged. For this reason, the number of program
and erase cycles is limited (see Table 18. for val-
ue) and it is recommended to implement Garbage
Collection, a Wear-Leveling Algorithm and an Er-
ror Correction Code, to extend the number of pro-
gram and erase cycles and increase the data
retention.
To help integrate a NAND memory into an applica-
tion ST Microelectronics can provide:
A Demo board with NAND simulation software
for PCs
File System OS Native reference software,
which supports the basic commands of file
management.
Contact the nearest ST Microelectronics sales of-
fice for more details.
Bad Block Management
Devices with Bad Blocks have the same quality
level and the same AC and DC characteristics as
devices where all the blocks are valid. A Bad Block
does not affect the performance of valid blocks be-
cause it is isolated from the bit line and common
source line by a select transistor.
The devices are supplied with all the locations in-
side valid blocks erased (FFh). The Bad Block In-
formation is written prior to shipping. Any block,
where the 1st and 6th Bytes, or 1st Word, in the
spare area of the 1st page, does not contain FFh,
is a Bad Block.
The Bad Block Information must be read before
any erase is attempted as the Bad Block Informa-
tion may be erased. For the system to be able to
recognize the Bad Blocks based on the original in-
formation it is recommended to create a Bad Block
table following the flowchart shown in Figure 22.
Block Replacement
Over the lifetime of the device additional Bad
Blocks may develop. In this case the block has to
be replaced by copying the data to a valid block.
These additional Bad Blocks can be identified as
attempts to program or erase them will give errors
in the Status Register.
As the failure of a page program operation does
not affect the data in other pages in the same
block, the block can be replaced by re-program-
ming the current data and copying the rest of the
replaced block to an available valid block. The
Copy Back Program command can be used to
copy the data to a valid block.
See the “Copy Back Program” section for more de-
tails.
Refer to Table 17. for the recommended proce-
dure to follow if an error occurs during an opera-
tion.
Table 17. Block Failure
Figure 22. Bad Block Management Flowchart
Operation
Recommended Procedure
Erase
Block Replacement
Program
Block Replacement or ECC
Read
ECC
AI07588C
START
END
NO
YES
NO
Block Address =
Block 0
Data
= FFh?
Last
block?
Increment
Block Address
Update
Bad Block table
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NAND01GR3M0AZB5E 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP
NAND01GR3M0AZB5F 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP
NAND01GR3M0AZC5E 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP
NAND01GR3M0AZC5F 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP
NAND01GR3M0BZB5E 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP