参数资料
型号: NCP5318FTR2G
厂商: ON Semiconductor
文件页数: 31/32页
文件大小: 0K
描述: IC CTLR CPU 2/3/4 PHASE 32-LQFP
产品变化通告: Product Obsolescence 08/Apr/2011
标准包装: 1
应用: 控制器,CPU
输入电压: 9.5 V ~ 13.2 V
输出数: 4
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 32-LQFP
供应商设备封装: 32-LQFP(7x7)
包装: 剪切带 (CT)
其它名称: NCP5318FTR2GOSCT
NCP5318
PACKAGE DIMENSIONS
32 LEAD LQFP
CASE 873A ? 02
ISSUE C
? T ?
1
32
A1
A
25
4X
0.20 (0.008) AB T?U Z
? U ?
P
AE
B
V
B1
8
DETAIL Y
17
V1
DETAIL Y
AE
BASE
METAL
N
9
9
S1
? Z ?
4X
0.20 (0.008) AC T?U Z
F
D
S
8X M _
R
J
SEATING
PLANE
? AB ?
? AC ?
G
0.10 (0.004) AC
DETAIL AD
C E
H
W
K
Q _
SECTION AE ? AE
X
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE ? AB ? IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS ? T ? , ? U ? , AND ? Z ? TO BE
DETERMINED AT DATUM PLANE ? AB ? .
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE ? AC ? .
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE ? AB ? .
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
MILLIMETERS
MIN MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400 1.600
0.300 0.450
1.350 1.450
0.300 0.400
0.800 BSC
0.050 0.150
0.090 0.200
0.450 0.750
12 _ REF
0.090 0.160
0.400 BSC
1 _ 5 _
0.150 0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055 0.063
0.012 0.018
0.053 0.057
0.012 0.016
0.031 BSC
0.002 0.006
0.004 0.008
0.018 0.030
12 _ REF
0.004 0.006
0.016 BSC
1 _ 5 _
0.006 0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
http://onsemi.com
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