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参数资料
| 型号： | NTMD2C02R2SG |
| 厂商： | ON Semiconductor |
| 文件页数： | 11/12页 |
| 文件大小： | 0K |
| 描述： | MOSFET N/P-CH COMPL 20V 8-SOIC |
| 产品变化通告： | Wire Change 20/Aug/2008 Product Discontinuation 01/Oct/2008 |
| 标准包装： | 2,500 |
| FET 型： | N 和 P 沟道 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 20V |
| 电流 - 连续漏极(Id) @ 25° C： | 5.2A，3.4A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 43 毫欧 @ 4A，4.5V |
| Id 时的 Vgs(th)（最大）： | 1.2V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 20nC @ 4.5V |
| 输入电容 (Ciss) @ Vds： | 1100pF @ 10V |
| 功率 - 最大： | 2W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 带卷 (TR) |
NTMD2C02R2
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 26 shows a typical heating
profile for use when soldering a surface mount device to a
printed circuit board. This profile will vary among
soldering systems, but it is a good starting point. Factors
that can affect the profile include the type of soldering
system in use, density and types of components on the
board, type of solder used, and the type of board or
substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density
board. The Vitronics SMD310 convection/infrared reflow
soldering system was used to generate this profile. The type
of solder used was 62/36/2 Tin Lead Silver with a melting
point between 177 ? 189 ° C. When this type of furnace is
used for solder reflow work, the circuit boards and solder
joints tend to heat first. The components on the board are
then heated by conduction. The circuit board, because it has
a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may
be up to 30 degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
STEP 2
VENT
STEP 3
HEATING
STEP 4
HEATING
STEP 5
HEATING
STEP 6
VENT
STEP 7
COOLING
ZONE 1
“SOAK” ZONES 2 & 5
ZONES 3 & 6
ZONES 4 & 7
200 ° C
“RAMP” “RAMP”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150 ° C
“SOAK”
160 ° C
“SPIKE”
170 ° C
205 ° TO 219 ° C
PEAK AT
SOLDER
JOINT
150 ° C
SOLDER IS LIQUID FOR
100 ° C
100 ° C
140 ° C
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
5 ° C
TIME (3 TO 7 MINUTES TOTAL)
Figure 26. Typical Solder Heating Profile
http://onsemi.com
11
T MAX
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NTMD2P01R2 | 功能描述:MOSFET -16V 2.3A Dual RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| NTMD2P01R2G | 功能描述:MOSFET -16V 2.3A Dual P-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| NTMD3N08 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 80V V(BR)DSS | SO |
| NTMD3N08/D | 制造商:未知厂家 制造商全称:未知厂家 功能描述:80 V Power MOSFET |
| NTMD3N08L | 制造商:未知厂家 制造商全称:未知厂家 功能描述:TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 80V V(BR)DSS | SO |
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