参数资料
型号: SC16C850IET,157
厂商: NXP Semiconductors
文件页数: 12/55页
文件大小: 0K
描述: IC UART SINGLE W/FIFO 36-TFBGA
标准包装: 2,450
特点: 可编程
通道数: 1,UART
FIFO's: 128 字节
规程: RS485
电源电压: 2.5 V ~ 3.3 V
带自动流量控制功能:
带IrDA 编码器/解码器:
带故障启动位检测功能:
带调制解调器控制功能:
带CMOS:
安装类型: 表面贴装
封装/外壳: 36-TFBGA
供应商设备封装: 36-TFBGA(3.5x3.5)
包装: 托盘
其它名称: 935284685157
SC16C850IET
SC16C850IET-ND
SC16C850
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 11 November 2010
2 of 55
NXP Semiconductors
SC16C850
2.5 to 3.3 V UART with 128-byte FIFOs and IrDA encoder/decoder
Programmable Xon/Xoff characters
Software selectable baud rate generator
Support IrDA version 1.0 (up to 115.2 kbit/s)
Standard modem interface or infrared IrDA encoder/decoder interface
Enhanced Sleep mode and low power feature
Modem control functions (CTS, RTS, DSR, DTR, RI, CD)
Independent transmitter and receiver enable/disable
Pb-free, RoHS compliant package offered
3.
Ordering information
[1]
SC16C850IBS/Q900 is AEC-Q100 compliant. Contact i2c.support@nxp.com for PPAP.
Table 1.
Ordering information
Type number
Package
Name
Description
Version
SC16C850IBS
HVQFN32
plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5
× 5 × 0.85 mm
SOT617-1
SC16C850IBS/Q900
HVQFN32
plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5
× 5 × 0.85 mm
SOT617-1
SC16C850IET
TFBGA36
plastic thin fine-pitch ball grid array package; 36 balls;
body 3.5
× 3.5 × 0.8 mm
SOT912-1
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