
TMS320C6203B, TMS320C6203C
FIXEDPOINT DIGITAL SIGNAL PROCESSORS
SPRS086G – JANUARY 1999 – REVISED JANUARY 2002
35
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
device and development-support tool nomenclature (continued)
Table 15. TMS320C6203B and TMS320C6203C Device Part Numbers (P/Ns) and Ordering Information
DEVICE ORDERABLE P/N
DEVICE SPEED
CORE and I/O VOLTAGE
OPERATING CASE
TEMPERATURE
DEVICE ORDERABLE P/N
DEVICE SPEED
CVDD (CORE)
DVDD (I/O)
TEMPERATURE
RANGE
C6203B Rev. 2
TMS320C6203BGLSH
250 MHz/2000 MIPS
1.5 V
3.3 V
0
_C to 90_C
TMS32C6203BGLS173H
300 MHz/2400 MIPS
1.7 V
3.3 V
0
_C to 90_C
TMS320C6203BGLS-3H
300 MHz/2400 MIPS
1.5 V
3.3 V
0
_C to 90_C
C6203B Rev. 3
TMS320C6203BGNY300
300 MHz/2400 MIPS
1.5 V
3.3 V
0
_C to 90_C
TMS320C6203BGNY173
300 MHz/2000 MIPS
1.7 V
3.3 V
0
_C to 90_C
TMS320C6203BGNY3E
300 MHz/2400 MIPS
1.5 V
3.3 V
0
_C to 90_C
TMS320C6203BGNY173
250 MHz/2000 MIPS
1.5 V
3.3 V
0
_C to 90_C
C6203C
TMX320C6203CGNY
300 MHz/2400 MIPS
1.2 V
3.3 V
0
_C to 90_C
TMX320C6203CGNZ
300 MHz/2400 MIPS
1.2 V
3.3 V
0
_C to 90_C
PREFIX
DEVICE SPEED RANGE
TMS 320
C 6203C GNZ
300
TMX = Experimental device
TMP = Prototype device
TMS = Qualified device
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
DEVICE FAMILY
320 = TMS320
t DSP family
TECHNOLOGY
PACKAGE TYPE
GFN = 256-pin plastic BGA
GGP = 352-pin plastic BGA
GJC = 352-pin plastic BGA
GJL = 352-pin plastic BGA
GLS = 384-pin plastic BGA
GLW = 340-pin plastic BGA
GNY = 384-pin plastic BGA
GNZ = 352-pin plastic BGA
GHK = 288-pin plastic MicroStar BGA
t
C = CMOS
DEVICE
C6000 DSP:
6201
6204
6414
6711
6202
6205
6415
6711B
6202B
6211
6416
6712
6203B
6211B
6701
6203C
BGA =
Ball Grid Array
TEMPERATURE RANGE (DEFAULT: 0
°C TO 90°C)
( )
Blank = 0
°C to 90°C, commercial temperature
A= –40
°C to 105°C, extended temperature
100 MHz
120 MHz
150 MHz
167 MHz
200 MHz
233 MHz
250 MHz
300 MHz
Figure 4. TMS320C6000
DSP Platform Device Nomenclature
(Including TMS320C6203B and TMS320C6203C)
PRODUCT
PREVIEW
MicroStar BGA is a trademark of Texas Instruments.