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参数资料
| 型号： | W25Q64CVSFIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 2/80页 |
| 文件大小： | 0K |
| 描述： | IC SPI FLASH 64MBIT 16SOIC |
| 标准包装： | 44 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 64M（8M x 8） |
| 速度： | 80MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 管件 |
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W25Q64CV
Table of Contents
1.
2.
3.
GENERAL DESCRIPTION ............................................................................................................... 5
FEATURES ....................................................................................................................................... 5
PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 6
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6
Pad Configuration WSON 6x5-mm / 8X6-mm...................................................................... 6
Pin Configuration PDIP 300-mil............................................................................................ 7
Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil .................... 7
Pin Configuration SOIC 300-mil ........................................................................................... 8
Pin Description SOIC 300-mil............................................................................................... 8
Ball Configuration TFBGA 8x6-mm ...................................................................................... 9
Ball Description TFBGA 8x6-mm ......................................................................................... 9
4.
PIN DESCRIPTIONS ...................................................................................................................... 10
4.1
4.2
4.3
4.4
4.5
Chip Select (/CS) ................................................................................................................ 10
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................. 10
Write Protect (/WP)............................................................................................................. 10
HOLD (/HOLD) ................................................................................................................... 10
Serial Clock (CLK) .............................................................................................................. 10
5.
6.
BLOCK DIAGRAM .......................................................................................................................... 11
FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12
6.1
SPI OPERATIONS ............................................................................................................. 12
6.1.1
6.1.2
6.1.3
6.1.4
Standard SPI Instructions ..................................................................................................... 12
Dual SPI Instructions ............................................................................................................ 12
Quad SPI Instructions ........................................................................................................... 12
Hold Function........................................................................................................................ 12
6.2
WRITE PROTECTION ....................................................................................................... 13
6.2.1
Write Protect Features .......................................................................................................... 13
7.
STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 14
7.1
STATUS REGISTERS........................................................................................................ 14
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
7.1.8
BUSY Status (BUSY) ............................................................................................................ 14
Write Enable Latch Status (WEL) ......................................................................................... 14
Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 14
Top/Bottom Block Protect Bit (TB) ........................................................................................ 14
Sector/Block Protect Bit (SEC) ............................................................................................. 14
Complement Protect Bit (CMP)............................................................................................. 15
Status Register Protect Bit (SRP1, SRP0) ............................................................................ 15
Erase/Program Suspend Status (SUS) ................................................................................. 15
-2-
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q64CVSFIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVSSAG | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVSSAP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVSSIG | 功能描述:IC SPI FLASH 64MBIT 8-SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.173"，4.40mm 宽） 供应商设备封装:8-MFP 包装:带卷 (TR) |
| W25Q64CVSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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