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参数资料
型号： W25Q64DWZPIP
厂商： WINBOND ELECTRONICS CORP
元件分类： PROM
英文描述： 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
封装： 6 X 5 MM, GREEN, WSON-8
文件页数： 12/82页
文件大小： 914K
代理商： W25Q64DWZPIP
W25Q64DW
- 2 -
Table of Contents
1.
GENERAL DESCRIPTION ............................................................................................................... 5
2.
FEATURES....................................................................................................................................... 5
3.
PIN CONFIGURATION SOIC 208-MIL ............................................................................................ 6
4.
PAD CONFIGURATION WSON 6X5-MM / 8X6-MM ....................................................................... 6
5.
PIN DESCRIPTION SOIC 208-MIL, WSON 6X5/8X6-MM............................................................... 6
6.
PIN CONFIGURATION SOIC 300-MIL ............................................................................................ 7
7.
PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 7
7.1
Package Types..................................................................................................................... 8
7.2
Chip Select (/CS).................................................................................................................. 8
7.3
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 8
7.4
Write Protect (/WP)............................................................................................................... 8
7.5
HOLD (/HOLD) ..................................................................................................................... 8
7.6
Serial Clock (CLK) ................................................................................................................ 8
8.
BLOCK DIAGRAM ............................................................................................................................ 9
9.
FUNCTIONAL DESCRIPTION ....................................................................................................... 10
9.1
SPI/QPI OPERATIONS ...................................................................................................... 10
9.1.1
Standard SPI Instructions .....................................................................................................10
9.1.2
Dual SPI Instructions ............................................................................................................10
9.1.3
Quad SPI Instructions ...........................................................................................................11
9.1.4
QPI Instructions ....................................................................................................................11
9.1.5
Hold Function........................................................................................................................11
9.2
WRITE PROTECTION ....................................................................................................... 12
9.2.1
Write Protect Features ..........................................................................................................12
10.
CONTROL AND STATUS REGISTERS ........................................................................................ 13
10.1
STATUS REGISTER .......................................................................................................... 13
10.1.1
BUSY ..................................................................................................................................13
10.1.2
Write Enable Latch (WEL) ..................................................................................................13
10.1.3
Block Protect Bits (BP2, BP1, BP0) ....................................................................................13
10.1.4
Top/Bottom Block Protect (TB) ...........................................................................................13
10.1.5
Sector/Block Protect (SEC).................................................................................................13
10.1.6
Complement Protect (CMP) ................................................................................................14
10.1.7
Status Register Protect (SRP1, SRP0) ...............................................................................14
10.1.8
Erase/Program Suspend Status (SUS)...............................................................................14
10.1.9
Security Register Lock Bits (LB3, LB2, LB1, LB0) ..............................................................14
10.1.10
Quad Enable (QE) ............................................................................................................15
10.1.11
W25Q64DW Status Register Memory Protection (CMP = 0) ............................................16
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相关代理商/技术参数
参数描述
W25Q64FVDAIG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVDAIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVSFIG 功能描述:IC SPI FLASH 64MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M（256K x 18） 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP（14x20） 包装:托盘
W25Q64FVSFIG TR 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 16SOIC
W25Q64FVSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
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