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参数资料
| 型号： | W25Q64DWZPIP |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8 |
| 封装： | 6 X 5 MM, GREEN, WSON-8 |
| 文件页数： | 2/82页 |
| 文件大小： | 914K |
| 代理商： | W25Q64DWZPIP |
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W25Q64DW
- 10 -
9.
FUNCTIONAL DESCRIPTION
9.1
SPI/QPI OPERATIONS
Figure 3. W25Q64DW Serial Flash Memory Operation Diagram
9.1.1
Standard SPI Instructions
The W25Q64DW is accessed through an SPI compatible bus consisting of four signals: Serial Clock
(CLK), Chip Select (/CS), Serial Data Input (DI) and Serial Data Output (DO). Standard SPI instructions
use the DI input pin to serially write instructions, addresses or data to the device on the rising edge of
CLK. The DO output pin is used to read data or status from the device on the falling edge of CLK.
SPI bus operation Mode 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and
Mode 3 concerns the normal state of the CLK signal when the SPI bus master is in standby and data is
not being transferred to the Serial Flash. For Mode 0, the CLK signal is normally low on the falling and
rising edges of /CS. For Mode 3, the CLK signal is normally high on the falling and rising edges of /CS.
9.1.2
Dual SPI Instructions
The W25Q64DW supports Dual SPI operation when using instructions such as “Fast Read Dual Output
(3Bh)” and “Fast Read Dual I/O (BBh)”. These instructions allow data to be transferred to or from the
device at two to three times the rate of ordinary Serial Flash devices. The Dual SPI Read instructions are
ideal for quickly downloading code to RAM upon power-up (code-shadowing) or for executing non-speed-
critical code directly from the SPI bus (XIP). When using Dual SPI instructions, the DI and DO pins
become bidirectional I/O pins: IO0 and IO1.
Power On
Standard SPI
Dual SPI
Quad SPI
operations
QPI
operations
Device
Initialization
Enable QPI (38h)
Disable QPI (FFh)
Reset (66h + 99h)
Power On
Standard SPI
Dual SPI
Quad SPI
operations
QPI
operations
Device
Initialization
Enable QPI (38h)
Disable QPI (FFh)
Reset (66h + 99h)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q64FVDAIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q64FVDAIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q64FVSFIG | 功能描述:IC SPI FLASH 64MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M（256K x 18） 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP（14x20） 包装:托盘 |
| W25Q64FVSFIG TR | 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 16SOIC |
| W25Q64FVSFIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
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