参数资料
型号: W25Q64DWZPIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
封装: 6 X 5 MM, GREEN, WSON-8
文件页数: 79/82页
文件大小: 914K
代理商: W25Q64DWZPIP
W25Q64DW
- 80 -
13. ORDERING INFORMATION
Notes:
1.
The “W” prefix is not included on the part marking.
2.
Only the 2
nd letter is used for the part marking; WSON package type ZP and ZE are not used for the part
marking.
3.
Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
Reel (shape T) or Tray (shape S), when placing orders.
4.
For shipments with OTP feature enabled, please specify when placing orders.
W(1) 25Q 64D W xx(2)
W
=
Winbond
25Q
=
SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
64D
=
64M-bit
W =
1.7V to 1.95V
SS
=
8-pin SOIC 208-mil
ZP
=
8-pad WSON 6x5mm
SF
=
16-pin SOIC 300-mil
ZE
=
8-pad WSON 8x6mm
I
=
Industrial (-40°C to +85°C)
(3,4)
G
=
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
P
=
Green Package with Status Register Power-Down & OTP enabled
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