参数资料
型号: W25Q64DWZPIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
封装: 6 X 5 MM, GREEN, WSON-8
文件页数: 9/82页
文件大小: 914K
代理商: W25Q64DWZPIP
W25Q64DW
Publication Release Date: January 13, 2011
- 17 -
Preliminary - Revision C
10.1.12 W25Q64DW Status Register Memory Protection (CMP = 1)
STATUS REGISTER
(1)
W25Q64CV (64M-BIT) MEMORY PROTECTION
(3)
SEC
TB
BP2
BP1
BP0
PROTECTED
BLOCK(S)
PROTECTED
ADDRESSES
PROTECTED
DENSITY
PROTECTED
PORTION
(2)
X
0
0 thru 127
000000h – 7FFFFFh
8MB
ALL
0
1
0 thru 125
000000h – 7DFFFFh
8,064KB
Lower 63/64
0
1
0
0 thru 123
000000h – 7BFFFFh
7,936KB
Lower 31/32
0
1
0 thru 119
000000h – 77FFFFh
7,680KB
Lower 15/16
0
1
0
0 thru 111
000000h – 6FFFFFh
7MB
Lower 7/8
0
1
0
1
0 thru 95
000000h – 5FFFFFh
5MB
Lower 3/4
0
1
0
0 thru 63
000000h – 3FFFFFh
4MB
Lower 1/2
0
1
0
1
2 thru 127
020000h – 7FFFFFh
8,064KB
Upper 63/64
0
1
0
1
0
4 thru 127
040000h – 7FFFFFh
7,936KB
Upper 31/32
0
1
0
1
8 thru 127
080000h – 7FFFFFh
7,680KB
Upper 15/16
0
1
0
16 thru 127
100000h – 7FFFFFh
7MB
Upper 7/8
0
1
0
1
32 thru 127
200000h – 7FFFFFh
5MB
Upper 3/4
0
1
0
64 thru 127
400000h – 7FFFFFh
4MB
Upper 1/2
X
1
NONE
1
0
1
0 thru 127
000000h – 7FEFFFh
8,188KB
L – 2047/2048
1
0
1
0
0 thru 127
000000h – 7FDFFFh
8,184KB
L – 1023/1024
1
0
1
0 thru 127
000000h – 7FBFFFh
8,176KB
L – 511/512
1
0
1
0
X
0 thru 127
000000h – 7F7FFFh
8,160KB
L – 255/256
1
0
1
0 thru 127
001000h – 7FFFFFh
8,188KB
L – 2047/2048
1
0
1
0
0 thru 127
002000h – 7FFFFFh
8,184KB
L – 1023/1024
1
0
1
0 thru 127
004000h – 7FFFFFh
8,176KB
L – 511/512
1
0
X
0 thru 127
008000h – 7FFFFFh
8,160KB
L – 255/256
Note:
1. X = don’t care
2. L = Lower; U = Upper
3. If any Erase or Program command specifies a memory region that contains protected data portion, this
command will be ignored.
相关PDF资料
PDF描述
W25Q80BLSNIG 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q80BVZPAG 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q80BVSNIP 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25X10AVDIAZ 128K X 8 FLASH 2.7V PROM, PDIP8
W25X16AVDAIG 2M X 8 FLASH 2.7V PROM, PDIP8
相关代理商/技术参数
参数描述
W25Q64FVDAIG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVDAIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVSFIG 功能描述:IC SPI FLASH 64MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M(256K x 18) 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x20) 包装:托盘
W25Q64FVSFIG TR 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 16SOIC
W25Q64FVSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI