参数资料
型号: W25Q64DWZPIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
封装: 6 X 5 MM, GREEN, WSON-8
文件页数: 51/82页
文件大小: 914K
代理商: W25Q64DWZPIP
W25Q64DW
Publication Release Date: January 13, 2011
- 55 -
Preliminary - Revision C
10.2.30 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 29. The Device ID values for the W25Q64DW is listed in Manufacturer and Device Identification
table. The instruction is completed by driving /CS high.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (90h)
High Impedance
8
9
10
28
29
30
31
Address (000000h)
23
22
21
3
2
1
0
Device ID
*
/CS
CLK
DI
(IO
0)
DO
(IO
1)
32
33
34
35
36
37
38
39
Manufacturer ID (EFh)
40
41
42
44
45
46
7
6
5
4
3
2
1
0
*
43
31
0
Mode 0
Mode 3
= MSB
*
Figure 29. Read Manufacturer / Device ID Instruction (SPI Mode)
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