参数资料
型号: W25Q80BVSSIG
厂商: Winbond Electronics
文件页数: 2/75页
文件大小: 0K
描述: IC FLASH 8MBIT 8SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 8M(1M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
其它名称: Q4816329
T1015683
W25Q80BV
Table of Contents
1.
2.
3.
GENERAL DESCRIPTION ............................................................................................................... 5
FEATURES ....................................................................................................................................... 5
PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 6
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
Pin Configuration SOIC 150 / 208-mil .................................................................................. 6
Pad Configuration WSON 6x5-mm / USON 2x3-mm ........................................................... 6
Pin Configuration PDIP 300-mil............................................................................................ 7
Pin Description SOIC, WSON, USON & PDIP 300-mil ........................................................ 7
pin descriptions..................................................................................................................... 8
Chip Select (/CS) .................................................................................................................. 8
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 8
Write Protect (/WP)............................................................................................................... 8
HOLD (/HOLD) ..................................................................................................................... 8
Serial Clock (CLK) ................................................................................................................ 8
4.
5.
BLOCK DIAGRAM ............................................................................................................................ 9
FUNCTIONAL DESCRIPTION ....................................................................................................... 10
5.1
SPI OPERATIONS ............................................................................................................. 10
5.1.1
5.1.2
5.1.3
5.1.4
Standard SPI Instructions ..................................................................................................... 10
Dual SPI Instructions ............................................................................................................ 10
Quad SPI Instructions .......................................................................................................... 10
Hold Function ....................................................................................................................... 10
5.2
WRITE PROTECTION ....................................................................................................... 11
5.2.1
Write Protect Features ......................................................................................................... 11
6.
CONTROL AND STATUS REGISTERS ........................................................................................ 12
6.1
STATUS REGISTER .......................................................................................................... 12
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
BUSY ................................................................................................................................... 12
Write Enable Latch (WEL) .................................................................................................... 12
Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 12
Top/Bottom Block Protect (TB) ............................................................................................. 12
Sector/Block Protect (SEC) .................................................................................................. 12
Complement Protect (CMP) ................................................................................................. 13
Status Register Protect (SRP1, SRP0) ................................................................................ 13
Erase/Program Suspend Status (SUS) ................................................................................ 13
Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 13
Quad Enable (QE) .............................................................................................................. 14
Status Register Memory Protection (CMP = 0)................................................................... 15
Status Register Memory Protection (CMP = 1)................................................................... 16
6.2
INSTRUCTIONS................................................................................................................. 17
6.2.1
Manufacturer and Device Identification ................................................................................ 17
-2-
相关PDF资料
PDF描述
M1A3P600-FGG256 IC FPGA 1KB FLASH 600K 256-FBGA
HMM43DRYI CONN EDGECARD 86POS DIP .156 SLD
M1A3P600-FG256 IC FPGA 1KB FLASH 600K 256-FBGA
RCB70DHBT CONN EDGECARD 140PS R/A .050 DIP
A3P600-FG256 IC FPGA 1KB FLASH 600K 256-FBGA
相关代理商/技术参数
参数描述
W25Q80BVSSIG TR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 8M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 8MBIT 104MHZ 8SOIC
W25Q80BVSSIG/REELS 制造商:Winbond Electronics Corp 功能描述:
W25Q80BVSSIG-T 制造商:Winbond Electronics 功能描述:8MB SPI FLASH
W25Q80BVSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q80BVZPAG 制造商:WINBOND 制造商全称:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI