参数资料
| 型号： | XA3S400A-4FGG400Q |
| 厂商： | Xilinx Inc |
| 文件页数： | 53/57页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN-3A 400K 400-FBGA |
| 产品培训模块： | Extended Spartan 3A FPGA Family |
| 标准包装： | 1 |
| 系列： | Spartan®-3A XA |
| LAB/CLB数： | 896 |
| 逻辑元件/单元数： | 8064 |
| RAM 位总计： | 368640 |
| 输入/输出数： | 311 |
| 门数： | 400000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 400-BGA |
| 供应商设备封装： | 400-FBGA（21x21） |
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XA Spartan-3A Automotive FPGA Family Data Sheet
DS681 (v2.0) April 22, 2011
Product Specification
57
Revision History
The following table shows the revision history for this document.
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products in Critical Applications: http://www.xilinx.com/warranty.htm#critapps.
Automotive Applications Disclaimer
XILINX PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE, OR FOR USE IN ANY APPLICATION REQUIRING
FAIL-SAFE PERFORMANCE, SUCH AS APPLICATIONS RELATED TO: (I) THE DEPLOYMENT OF AIRBAGS, (II) CONTROL OF A
VEHICLE, UNLESS THERE IS A FAIL-SAFE OR REDUNDANCY FEATURE (WHICH DOES NOT INCLUDE USE OF SOFTWARE IN
THE XILINX DEVICE TO IMPLEMENT THE REDUNDANCY) AND A WARNING SIGNAL UPON FAILURE TO THE OPERATOR, OR (III)
USES THAT COULD LEAD TO DEATH OR PERSONAL INJURY. CUSTOMER ASSUMES THE SOLE RISK AND LIABILITY OF ANY
USE OF XILINX PRODUCTS IN SUCH APPLICATIONS.
Date
Version
Revision
04/30/08
1.0
Initial release.
05/07/08
1.0.1
Updated Figure 14, minor edits under Features and Package Marking, Table 20 and 21.
02/03/09
1.1
Updated Key Feature Differences from Commercial XC Devices, page 2. Removed MultiBoot description
(commercial only) speed grade from Ordering Information, page 5. Replaced VICM with VCCAUX in Note 7 of
Table 13. Added versions 1.40 and 1.41 to Table 17. Updated Note 2 in Figure 11. Removed TIOOLP from
Table 23. Updated TIOCKHZ and TIOCKON in Table 24. Updated Table 22 and Table 25. Updated SSO number
for left and right I/O banks of DIFF_SSTL18_II standard in Table 28. Updated TACC requirement in Table 54.
04/22/11
2.0
This revision goes along with XCN11019: Data Sheet Revisions for Xilinx Automotive (XA) Spartan-3A/-3A
DSP FPGA Devices. Added IIK to Table 4. Updated description for VIN in Table 8 including adding Note 4.
Also, added Note 2 to IL in Table 9 to note potential leakage between pins of a differential pair. Updated Notes
5 and 6 in Table 13. Table 20: Updated tags to Note 3. In Table 42, corrected symbols for TDNACLKH and
TDNACLKL. Corrected symbols for TSUSPEND_GTS and TSUSPEND_GWE in Table 43. Revised standard title to:
相关PDF资料 |
PDF描述 |
|---|---|
| XC2V80-4FG256I | IC FPGA VIRTEX-II 256FGBGA |
| RMM43DTAH | CONN EDGECARD 86POS R/A .156 SLD |
| 25AA080AT-I/MS | IC EEPROM 8KBIT 10MHZ 8MSOP |
| XC3SD1800A-4FGG676I | SPARTAN-3ADSP FPGA 1800K 676FBGA |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XA3S400A-4FTG256I | 功能描述:IC FPGA SPARTAN-3A 400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S400A-4FTG256Q | 功能描述:IC FPGA SPARTAN-3A 400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S500E | 制造商:XILINX 制造商全称:XILINX 功能描述:XA Spartan-3E Automotive FPGA Family Data Sheet |
| XA3S500E-4CPG132I | 功能描述:IC FPGA SPARTAN-3E 500K 132CSBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S500E-4CPG132Q | 功能描述:IC FPGA SPARTAN-3E 500K 132CSBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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