参数资料
| 型号： | XC2S400E-6FGG456C |
| 厂商： | Xilinx Inc |
| 文件页数： | 36/108页 |
| 文件大小： | 0K |
| 描述： | IC SPARTAN-IIE FPGA 400K 456FBGA |
| 产品变化通告： | FPGA Family Discontinuation 18/Apr/2011 |
| 标准包装： | 60 |
| 系列： | Spartan®-IIE |
| LAB/CLB数： | 2400 |
| 逻辑元件/单元数： | 10800 |
| RAM 位总计： | 163840 |
| 输入/输出数： | 329 |
| 门数： | 400000 |
| 电源电压： | 1.71 V ~ 1.89 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 456-BBGA |
| 供应商设备封装： | 456-FBGA |
| 其它名称： | 122-1327 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页当前第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页
DS077-3 (v3.0) August 9, 2013
33
Product Specification
Spartan-IIE FPGA Family: DC and Switching Characteristics
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Power-On Requirements
Spartan-IIE FPGAs require that a minimum supply current
ICCPO be provided to the VCCINT lines for a successful
power-on. If more current is available, the FPGA can con-
sume more than ICCPO min., though this cannot adversely
affect reliability.
A maximum limit for ICCPO is not specified. Be careful when
using foldback/crowbar supplies and fuses. It is possible to
control the magnitude of ICCPO by limiting the supply current
available to the FPGA. A current limit below the trip level will
avoid inadvertently activating over-current protection cir-
cuits.
DC Input and Output Levels
Values for VIL and VIH are recommended input voltages.
Values for VOL and VOH are guaranteed output voltages
over the recommended operating conditions. Only selected
standards are tested. These are chosen to ensure that all
standards meet their specifications. The selected standards
are tested at minimum VCCO with the respective IOL and IOH
currents shown. Other standards are sample tested.
Symbol
Description
Min(1)
Typ
Max
Units
ICCPO
Total VCCINT supply current
required during power-on
Commercial
XC2S50E - XC2S300E
After PCN(2)
300
-
mA
Before
PCN(2)
500
-
mA
XC2S400E - XC2S600E
500
-
mA
Industrial
XC2S50E - XC2S300E
After PCN(2)
500
-
mA
Before
PCN(2)
2
-
A
XC2S400E - XC2S600E
700
-
mA
TCCPO
VCCINT(3,4) ramp time
After PCN(2)
500
-
μs
Before PCN(2)
2
-
50
ms
IHSPO
AC current per pin during power-on in
hot-swap applications when
VIN > VCCO + 0.4V; duration < 10ns
After PCN(2)
-
±60
-
μA
Notes:
1.
The ICCPO requirement applies for a brief time (commonly only a few milliseconds) when VCCINT ramps from 0 to 1.8V.
2.
Devices built after the Product Change Notice PCN 2002-05 (see
http://www.xilinx.com/support/documentation/customer_notices/pcn2002-05.pdf) have improved power-on requirements. Devices
after the PCN have a ‘T’ preceding the date code as referenced in the PCN. Note that the XC2S150E, XC2S400E, and XC2S600E
always have this mark. Devices before the PCN have an ‘S’ preceding the date code. Note that devices before the PCN are
measured with VCCINT and VCCO powering up simultaneously.
3.
The ramp time is measured from GND to 1.8V on a fully loaded board.
4.
VCCINT must not dip in the negative direction during power on.
5.
I/Os are not guaranteed to be disabled until VCCINT is applied.
6.
For more information on designing to meet the power-on specifications, refer to the application note XAPP450 "Power-On Current
Input/Output
Standard
VIL
VIH
VOL
VOH
IOL
IOH
V, Min
V, Max
V, Min
V, Max
V, Min
mA
LVTTL(1)
–0.5
0.8
2.0
3.6
0.4
2.4
24
–24
LVCMOS2
–0.5
0.7
1.7
2.7
0.4
1.9
12
–12
LVCMOS18
–0.5
35% VCCO
65% VCCO
1.95
0.4
VCCO – 0.4
8
–8
PCI, 3.3V
–0.5
30% VCCO
50% VCCO
VCCO + 0.5
10% VCCO
90% VCCO
Note (2)
GTL
–0.5
VREF – 0.05
VREF + 0.05
3.6
0.4
-
40
-
GTL+
–0.5
VREF – 0.1
VREF + 0.1
3.6
0.6
-
36
-
相关PDF资料 |
PDF描述 |
|---|---|
| XA6SLX100-2FGG484I | IC FPGA SPARTAN 6 484FGGBGA |
| 25LC640T-E/SN | IC EEPROM 64KBIT 2MHZ 8SOIC |
| SST25VF020B-80-4C-SAE-T | IC FLASH SER 2MB 80MHZ SPI 8SOIC |
| XC6SLX100-N3FGG484I | IC FPGA SPARTAN-6 484FPGA |
| SST25LF020A-33-4C-SAE | IC FLASH SER 2MB 33HZ SPI 8SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC2S400E-6FGG456I | 制造商:Xilinx 功能描述:FPGA SPARTAN-IIE 400K GATES 10800 CELLS 357MHZ 1.8V 456FBGA - Trays |
| XC2S400E-6FGG676C | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA |
| XC2S400E-6FGG676I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA |
| XC2S400E-6FT256C | 功能描述:IC SPARTAN-IIE FPGA 400K 256FTBG RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC2S400E-6FT256I | 制造商:Xilinx 功能描述:FPGA SPARTAN-IIE 400K GATES 10800 CELLS 357MHZ 1.8V 256FTBGA - Trays |
发布紧急采购，3分钟左右您将得到回复。