参数资料
| 型号： | XC2S400E-6FGG456C |
| 厂商： | Xilinx Inc |
| 文件页数： | 60/108页 |
| 文件大小： | 0K |
| 描述： | IC SPARTAN-IIE FPGA 400K 456FBGA |
| 产品变化通告： | FPGA Family Discontinuation 18/Apr/2011 |
| 标准包装： | 60 |
| 系列： | Spartan®-IIE |
| LAB/CLB数： | 2400 |
| 逻辑元件/单元数： | 10800 |
| RAM 位总计： | 163840 |
| 输入/输出数： | 329 |
| 门数： | 400000 |
| 电源电压： | 1.71 V ~ 1.89 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 456-BBGA |
| 供应商设备封装： | 456-FBGA |
| 其它名称： | 122-1327 |
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DS077-4 (v3.0) August 9, 2013
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Product Specification
Spartan-IIE FPGA Family: Pinout Tables
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Spartan-IIE Package Pinouts
The Spartan-IIE family of FPGAs is available in five popu-
lar, low-cost packages, including plastic quad flat packs and
fine-pitch ball grid arrays. Family members have footprint
compatibility across devices provided in the same package,
with minor exceptions due to the smaller number of I/O in
smaller devices or due to LVDS/LVPECL pin pairing. The
Spartan-IIE family is not footprint compatible with any other
FPGA family. The following package-specific pinout tables
indicate function, pin, and bank information for all devices
available in that package. The pinouts follow the pad loca-
tions around the die, starting from pin 1 on the QFP pack-
ages.
Package Overview
Table 12 shows the five low-cost, space-saving production
package styles for the Spartan-IIE family.
Each package style is available in an environmentally
friendly lead-free (Pb-free) option. The Pb-free packages
include an extra ‘G’ in the package style name. For
example, the standard “TQ144” package becomes
“TQG144” when ordered as the Pb-free option. Leaded
(non-Pb-free) packages may be available for selected
devices, with the same pin-out and without the "G" in the
ordering code; contact Xilinx sales for more information.
The mechanical dimensions of the standard and Pb-free
packages are similar, as shown in the mechanical drawings
provided in Table 13.
For additional package information, see UG112: Device
Package User Guide.
Mechanical Drawings
Detailed mechanical drawings for each package type are
available from the Xilinx web site at the specified location in
Material Declaration Data Sheets (MDDS) are also
available on the Xilinx web site for each package.
Table 12: Spartan-IIE Family Package Options
Package
Leads
Type
Maximum
I/O
Lead Pitch
(mm)
Footprint
Area (mm)
Height
(mm)
Mass(1)
(g)
TQ144 / TQG144
144
Thin Quad Flat Pack (TQFP)
102
0.5
22 x 22
1.60
1.4
PQ208 / PQG208
208
Plastic Quad Flat Pack (PQFP)
146
0.5
30.6 x 30.6
3.70
5.3
FT256 / FTG256
256
Fine-pitch Thin Ball Grid Array (FBGA)
182
1.0
17 x 17
1.55
1.0
FG456 / FGG456
456
Fine-pitch Ball Grid Array (FBGA)
329
1.0
23 x 23
2.60
2.2
FG676 / FGG676
676
Fine-pitch Ball Grid Array (FBGA)
514
1.0
27 x 27
2.60
3.1
Notes:
1.
Package mass is
±10%.
Table 13: Xilinx Package Documentation
Package
Drawing
MDDS
TQ144
TQG144
PQ208
PQG208
FT256
FTG256
FG456
FGG456
FG676
FGG676
相关PDF资料 |
PDF描述 |
|---|---|
| XA6SLX100-2FGG484I | IC FPGA SPARTAN 6 484FGGBGA |
| 25LC640T-E/SN | IC EEPROM 64KBIT 2MHZ 8SOIC |
| SST25VF020B-80-4C-SAE-T | IC FLASH SER 2MB 80MHZ SPI 8SOIC |
| XC6SLX100-N3FGG484I | IC FPGA SPARTAN-6 484FPGA |
| SST25LF020A-33-4C-SAE | IC FLASH SER 2MB 33HZ SPI 8SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC2S400E-6FGG456I | 制造商:Xilinx 功能描述:FPGA SPARTAN-IIE 400K GATES 10800 CELLS 357MHZ 1.8V 456FBGA - Trays |
| XC2S400E-6FGG676C | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA |
| XC2S400E-6FGG676I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA |
| XC2S400E-6FT256C | 功能描述:IC SPARTAN-IIE FPGA 400K 256FTBG RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC2S400E-6FT256I | 制造商:Xilinx 功能描述:FPGA SPARTAN-IIE 400K GATES 10800 CELLS 357MHZ 1.8V 256FTBGA - Trays |
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