参数资料
| 型号： | XC3S700AN-4FG484I |
| 厂商： | Xilinx Inc |
| 文件页数： | 41/123页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN 3AN 484FBGA |
| 标准包装： | 60 |
| 系列： | Spartan®-3AN |
| LAB/CLB数： | 1472 |
| 逻辑元件/单元数： | 13248 |
| RAM 位总计： | 368640 |
| 输入/输出数： | 372 |
| 门数： | 700000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 484-BBGA |
| 供应商设备封装： | 484-FBGA |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页当前第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页
Spartan-3AN FPGA Family: DC and Switching Characteristics
DS557 (v4.1) April 1, 2011
Product Specification
24
Switching Characteristics
All Spartan-3AN FPGAs ship in two speed grades: -4 and
the higher performance -5. Switching characteristics in this
document are designated as Preview, Advance,
Preliminary, or Production, as shown in Table 19. Each
category is defined as follows:
Preview: These specifications are based on estimates only
and should not be used for timing analysis.
Advance: These specifications are based on simulations
only and are typically available soon after establishing
FPGA specifications. Although speed grades with this
designation are considered relatively stable and
conservative, some under-reporting might still occur.
Preliminary: These specifications are based on complete
early silicon characterization. Devices and speed grades
with this designation are intended to give a better indication
of the expected performance of production silicon. The
probability of under-reporting preliminary delays is greatly
reduced compared to Advance data.
Production: These specifications are approved once
enough production silicon of a particular device family
member has been characterized to provide full correlation
between speed files and devices over numerous production
lots. There is no under-reporting of delays, and customers
receive formal notification of any subsequent changes.
Typically, the slowest speed grades transition to Production
before faster speed grades.
Software Version Requirements
Production-quality systems must use FPGA designs
compiled using a speed file designated as PRODUCTION
status. FPGA designs using a less mature speed file
designation should only be used during system prototyping
or pre-production qualification. FPGA designs with speed
files designated as Preview, Advance, or Preliminary should
not be used in a production-quality system.
Whenever a speed file designation changes, as a device
matures toward Production status, rerun the latest Xilinx
ISE software on the FPGA design to ensure that the
FPGA design incorporates the latest timing information and
software updates.
In some cases, a particular family member (and speed
grade) is released to Production at a different time than
when the speed file is released with the Production label.
Any labeling discrepancies are corrected in subsequent
speed file releases. See Table 19 for devices that can be
considered to have the Production label.
All parameter limits are representative of worst-case supply
voltage and junction temperature conditions. Unless
otherwise noted, the published parameter values apply
to all Spartan-3AN devices. AC and DC characteristics
are specified using the same numbers for both
commercial and industrial grades.
Create a Xilinx user account and sign up to receive
automatic e-mail notification whenever this data sheet or
the associated user guides are updated.
Sign Up for Alerts
Timing parameters and their representative values are
selected for inclusion either because they are important as
general design requirements or they indicate fundamental
device performance characteristics. The Spartan-3AN
speed files (v1.41), part of the Xilinx Development Software,
are the original source for many but not all of the values.
The speed grade designations for these files are shown in
Table 19. For more complete, more precise, and worst-case
data, use the values reported by the Xilinx static timing
analyzer (TRACE in the Xilinx development software) and
back-annotated to the simulation netlist.
Table 20 provides the recent history of the Spartan-3AN
speed files.
Table 19: Spartan-3AN Family v1.41 Speed Grade
Designations
Device
Preview
Advance
Preliminary
Production
XC3S50AN
-4, -5
XC3S200AN
-4, -5
XC3S400AN
-4, -5
XC3S700AN
-4, -5
XC3S1400AN
-4, -5
Table 20: Spartan-3AN Speed File Version History
Version
ISE
Release
Description
1.41
ISE 10.1.03
Updated for Spartan-3A family. No
change to data for Spartan-3AN family.
1.40
ISE 10.1.02
Updated for Spartan-3A family. No
change to data for Spartan-3AN family.
1.39
ISE 10.1
Updated for Spartan-3A family. No
change to data for Spartan-3AN family.
1.38
ISE 9.2.03i
Updated to Production. No change to
data.
1.37
ISE 9.2.01i
Updated pin-to-pin setup and hold
times, TMDS output adjustment,
multiplier setup/hold times, and block
RAM clock width.
1.36
ISE 9.2i
Added -5 speed grade, updated to
Advance.
1.34
ISE 9.1.03i Updated pin-to-pin timing.
1.32
ISE 9.1.01i Preview speed files for -4 speed grade.
相关PDF资料 |
PDF描述 |
|---|---|
| 84981-4 | CONN FFC 4POS 1MM RT ANG SMD |
| XC5VTX240T-2FFG1759CES | IC FPGA VIRTEX5TX 240K 1759FBGA |
| ABB70DHBN | CONN EDGECARD 140PS R/A .050 SLD |
| XC5VTX240T-2FF1759CES | IC FPGA VIRTEX5TX 240K 1759FBGA |
| ABB70DHBD | CONN EDGECARD 140PS R/A .050 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC3S700AN-4FGG484C | 功能描述:IC SPARTAN-3AN FPGA 700K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3AN 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA（23x23） 其它名称:220-1241 |
| XC3S700AN-4FGG484CES | 制造商:Xilinx 功能描述: |
| XC3S700AN-4FGG484I | 功能描述:IC FPGA SPARTAN -3AN700K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3AN 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP（28x28） |
| XC3S700AN-5FG484C | 制造商:Xilinx 功能描述:FPGA SPARTAN-3AN FAMILY 700K GATES 13248 CELLS 770MHZ 90NM T - Trays 制造商:Xilinx 功能描述:IC FPGA 372 I/O 484FBGA |
| XC3S700AN-5FGG484C | 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3AN 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
发布紧急采购，3分钟左右您将得到回复。