参数资料
型号: XC3S700AN-4FG484I
厂商: Xilinx Inc
文件页数: 67/123页
文件大小: 0K
描述: IC FPGA SPARTAN 3AN 484FBGA
标准包装: 60
系列: Spartan®-3AN
LAB/CLB数: 1472
逻辑元件/单元数: 13248
RAM 位总计: 368640
输入/输出数: 372
门数: 700000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 484-BBGA
供应商设备封装: 484-FBGA
Spartan-3AN FPGA Family: DC and Switching Characteristics
DS557 (v4.1) April 1, 2011
Product Specification
48
Table 34: CLB Distributed RAM Switching Characteristics
Symbol
Description
Speed Grade
Units
-5
-4
Min
Max
Min
Max
Clock-to-Output Times
TSHCKO
Time from the active edge at the CLK input to data appearing on
the distributed RAM output
–1.69
–2.01
ns
Setup Times
TDS
Setup time of data at the BX or BY input before the active
transition at the CLK input of the distributed RAM
–0.07
–0.02
–ns
TAS
Setup time of the F/G address inputs before the active transition
at the CLK input of the distributed RAM
0.18
–0.36
–ns
TWS
Setup time of the write enable input before the active transition at
the CLK input of the distributed RAM
0.30
–0.59
–ns
Hold Times
TDH
Hold time of the BX and BY data inputs after the active transition
at the CLK input of the distributed RAM
0.13
–0.13
–ns
TAH, TWH
Hold time of the F/G address inputs or the write enable input after
the active transition at the CLK input of the distributed RAM
0.01
–0.01
–ns
Clock Pulse Width
TWPH, TWPL
Minimum High or Low pulse width at CLK input
0.88
–1.01
–ns
Notes:
1.
The numbers in this table are based on the operating conditions set forth in Table 10.
Table 35: CLB Shift Register Switching Characteristics
Symbol
Description
Speed Grade
Units
-5
-4
Min
Max
Min
Max
Clock-to-Output Times
TREG
Time from the active edge at the CLK input to data appearing on
the shift register output
–4.11
–4.82
ns
Setup Times
TSRLDS
Setup time of data at the BX or BY input before the active
transition at the CLK input of the shift register
0.13
–0.18
–ns
Hold Times
TSRLDH
Hold time of the BX or BY data input after the active transition at
the CLK input of the shift register
0.16
–0.16
–ns
Clock Pulse Width
TWPH, TWPL
Minimum High or Low pulse width at CLK input
0.90
–1.01
–ns
Notes:
1.
The numbers in this table are based on the operating conditions set forth in Table 10.
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XC3S700AN-4FGG484C 功能描述:IC SPARTAN-3AN FPGA 700K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3AN 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241
XC3S700AN-4FGG484CES 制造商:Xilinx 功能描述:
XC3S700AN-4FGG484I 功能描述:IC FPGA SPARTAN -3AN700K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3AN 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)
XC3S700AN-5FG484C 制造商:Xilinx 功能描述:FPGA SPARTAN-3AN FAMILY 700K GATES 13248 CELLS 770MHZ 90NM T - Trays 制造商:Xilinx 功能描述:IC FPGA 372 I/O 484FBGA
XC3S700AN-5FGG484C 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3AN 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)