参数资料
型号: XC3S700AN-4FG484I
厂商: Xilinx Inc
文件页数: 71/123页
文件大小: 0K
描述: IC FPGA SPARTAN 3AN 484FBGA
标准包装: 60
系列: Spartan®-3AN
LAB/CLB数: 1472
逻辑元件/单元数: 13248
RAM 位总计: 368640
输入/输出数: 372
门数: 700000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 484-BBGA
供应商设备封装: 484-FBGA
Spartan-3AN FPGA Family: DC and Switching Characteristics
DS557 (v4.1) April 1, 2011
Product Specification
51
Block RAM Timing
Table 38: Block RAM Timing
Symbol
Description
Speed Grade
Units
-5
-4
Min
Max
Min
Max
Clock-to-Output Times
TRCKO
When reading from block RAM, the delay from the active
transition at the CLK input to data appearing at the DOUT
output
–2.06
–2.49
ns
Setup Times
TRCCK_ADDR Setup time for the ADDR inputs before the active transition at
the CLK input of the block RAM
0.32
–0.36
–ns
TRDCK_DIB
Setup time for data at the DIN inputs before the active
transition at the CLK input of the block RAM
0.28
–0.31
–ns
TRCCK_ENB
Setup time for the EN input before the active transition at the
CLK input of the block RAM
0.69
–0.77
–ns
TRCCK_WEB
Setup time for the WE input before the active transition at the
CLK input of the block RAM
1.12
–1.26
–ns
Hold Times
TRCKC_ADDR Hold time on the ADDR inputs after the active transition at the
CLK input
0
–0
–ns
TRCKD_DIB
Hold time on the DIN inputs after the active transition at the
CLK input
0
–0
–ns
TRCKC_ENB
Hold time on the EN input after the active transition at the CLK
input
0
–0
–ns
TRCKC_WEB
Hold time on the WE input after the active transition at the CLK
input
0
–0
–ns
Clock Timing
TBPWH
High pulse width of the CLK signal
1.56
–1.79
–ns
TBPWL
Low pulse width of the CLK signal
1.56
–1.79
–ns
Clock Frequency
FBRAM
Block RAM clock frequency
0
320
0
280
MHz
Notes:
1.
The numbers in this table are based on the operating conditions set forth in Table 10.
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参数描述
XC3S700AN-4FGG484C 功能描述:IC SPARTAN-3AN FPGA 700K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3AN 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241
XC3S700AN-4FGG484CES 制造商:Xilinx 功能描述:
XC3S700AN-4FGG484I 功能描述:IC FPGA SPARTAN -3AN700K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3AN 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)
XC3S700AN-5FG484C 制造商:Xilinx 功能描述:FPGA SPARTAN-3AN FAMILY 700K GATES 13248 CELLS 770MHZ 90NM T - Trays 制造商:Xilinx 功能描述:IC FPGA 372 I/O 484FBGA
XC3S700AN-5FGG484C 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3AN 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)