参数资料
型号: XC3S700AN-4FG484I
厂商: Xilinx Inc
文件页数: 69/123页
文件大小: 0K
描述: IC FPGA SPARTAN 3AN 484FBGA
标准包装: 60
系列: Spartan®-3AN
LAB/CLB数: 1472
逻辑元件/单元数: 13248
RAM 位总计: 368640
输入/输出数: 372
门数: 700000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 484-BBGA
供应商设备封装: 484-FBGA
Spartan-3AN FPGA Family: Introduction and Ordering Information
DS557 (v4.1) April 1, 2011
Product Specification
5
Sector-based data protection and security features
Sector Protect: Write- and erase-protect a sector
(changeable)
Sector Lockdown: Sector data is unchangeable
(permanent)
128-byte Security Register
Separate from FPGA’s unique Device DNA
identifier
64-byte factory-programmed identifier unique to
the in-system Flash memory
64-byte one-time programmable,
user-programmable field
100,000 Program/Erase cycles
20-year data retention
Comprehensive programming support
In-system prototype programming via JTAG using
Xilinx Platform Cable USB and iMPACT software
Product programming support using BPM
Microsystems programmers with appropriate
programming adapter
Design examples demonstrating in-system
programming from a Spartan-3AN FPGA
application
I/O Capabilities
The Spartan-3AN FPGA SelectIO interface supports many
popular single-ended and differential standards. Table 4
shows the number of user I/Os as well as the number of
differential I/O pairs available for each device/package
combination. Some of the user I/Os are unidirectional,
input-only pins as indicated in Table 4.
Spartan-3AN FPGAs support the following single-ended
standards:
3.3V low-voltage TTL (LVTTL)
Low-voltage CMOS (LVCMOS) at 3.3V, 2.5V, 1.8V,
1.5V, or 1.2V
3.3V PCI at 33 MHz or 66 MHz
HSTL I, II, and III at 1.5V and 1.8V, commonly used in
memory applications
SSTL I and II at 1.8V, 2.5V, and 3.3V, commonly used
for memory applications
Spartan-3AN FPGAs support the following differential
standards:
LVDS, mini-LVDS, RSDS, and PPDS I/O at 2.5V or
3.3V
Bus LVDS I/O at 2.5V
TMDS I/O at 3.3V
Differential HSTL and SSTL I/O
LVPECL inputs at 2.5V or 3.3V
Table 4: Available User I/Os and Differential (Diff) I/O Pairs
Package(1)
TQ144
TQG144
FT256
FTG256
FG400
FGG400
FG484
FGG484
FG676
FGG676
Body Size (mm)
20 x 20(2)
17 x17
21x 21
23x23
27 x 27
Device(3)
User
Diff
User
Diff
User
Diff
User
Diff
User
Diff
XC3S50AN
108(4)
(7)
50
(24)
144
(32)
64
(32)
XC3S200AN
195
(35)
90
(50)
XC3S400AN
195
(35)
90
(50)
311
(63)
142
(78)
XC3S700AN
372
(84)
165
(93)
XC3S1400AN
375
(87)
165
(93)
502
(94)
227
(131)
Notes:
1.
See Pb and Pb-Free Packaging, page 7 for details on Pb and Pb-free packaging options.
2.
The footprint for the TQ(G)144 (22 mm x 22 mm) package is larger than the package body.
3.
Each Spartan-3AN FPGA has a pin-compatible Spartan-3A FPGA equivalent, although Spartan-3A FPGAs do not have internal SPI flash
and offer more part/package combinations.
4.
The number shown in bold indicates the maximum number of I/O and input-only pins. The number shown in (italics) indicates the number
of input-only pins. The differential (Diff) input-only pin count includes both differential pairs on input-only pins and differential pairs on I/O pins
within I/O banks that are restricted to differential inputs.
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