参数资料
型号: ADSP-21160MKB-80
厂商: Analog Devices Inc
文件页数: 40/52页
文件大小: 0K
描述: IC DSP CONTROLLER 32BIT 400 BGA
产品培训模块: SHARC Processor Overview
标准包装: 1
系列: SHARC®
类型: 浮点
接口: 主机接口,连接端口,串行端口
时钟速率: 80MHz
非易失内存: 外部
芯片上RAM: 512kB
电压 - 输入/输出: 3.30V
电压 - 核心: 2.50V
工作温度: 0°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 400-BBGA
供应商设备封装: 400-PBGA(27x27)
包装: 托盘
–45–
REV. 0
ADSP-21160M
Capacitive Loading
Output delays and holds are based on standard capacitive
loads: 50 pF on all pins (see Figure 31). The delay and hold
specifications given should be derated by a factor of
1.5 ns/50 pF for loads other than the nominal value of
50 pF. Figure 33 and Figure 34 show how output rise time
varies with capacitance. Figure 35 graphically shows how
output delays and holds vary with load capacitance. (Note
that this graph or derating does not apply to output disable
delays; see Output Disable Time on page 44.) The graphs
of Figure 33, Figure 34, and Figure 35 may not be linear
outside the ranges shown.
Environmental Conditions
The ADSP-21160M is tested for performance over the
commercial temperature range, 0°C to 85°C.
Thermal Characteristics
The ADSP-21160M is packaged in a 400-ball Plastic Ball
Grid Array (PBGA). The ADSP-21160M is specified for a
case temperature (T
CASE). To ensure that the TCASE data sheet
specification is not exceeded, a heatsink and/or an air flow
source may be used. Use the center block of ground pins
(PBGA balls: H8–13, J8–13, K8–13, L8–13, M8–13, and
N8–13) to provide thermal pathways to the printed circuit
board’s ground plane. A heatsink should be attached to the
ground plane (as close as possible to the thermal pathways)
with a thermal adhesive.
Figure 31. Equivalent Device Loading for AC
Measurements (Includes All Fixtures)
Figure 32. Voltage Reference Levels for AC
Measurements (Except Output Enable/Disable)
Figure 33. Typical Output Rise Time (10%–90%,
VDDEXT = Max) vs. Load Capacitance
9
S)
72
287387
3,1
,2/
,2+
,1387
25
287387
9
/2$' &$3$&,7$1&( ± S)
7%'
5,
6
(
$1'
)$
//
7,
0
(
6
±
QV
5,6( 7,0(
)$// 7,0(
< ;
Figure 34. Typical Output Rise Time (10%–90%,
VDDEXT = Min) vs. Load Capacitance
Figure 35. Typical Output Delay or Hold vs. Load
Capacitance (at Max Case Temperature)
/2$' &$3$&,7$1&( ± S)
7%'
5,
6
(
$1
'
)$/
/
7,
0
(
6
±
QV
)$// 7,0 (
< ;
5,6( 7,0(
/2$' &$3$&,7$1&( ± S)
±
28
73
8
7
'(
/$
<
25
+2
/'
±
QV
< ; ±
相关PDF资料
PDF描述
ADSP-21160NCB-100 IC DSP CONTROLLER 32BIT 400BGA
ADSP-21161NCCA-100 IC DSP CONTROLLER 32BIT 225MBGA
ADSP-21261SKBCZ150 IC DSP 32BIT 150MHZ 136-CSPBGA
ADSP-21368KBPZ-3A IC DSP 32BIT 400MHZ 256BGA
ADSP-21371BSWZ-2B IC DSP 32BIT 266MHZ 208-LQFP
相关代理商/技术参数
参数描述
ADSP-21160MKBZ-80 功能描述:IC DSP CONTROLLER 32BIT 400 BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:SHARC® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘
ADSP-21160N 制造商:AD 制造商全称:Analog Devices 功能描述:DSP Microcomputer
ADSP-21160NCB-100 功能描述:IC DSP CONTROLLER 32BIT 400BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:SHARC® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘
ADSP-21160NCB-TBD 制造商:AD 制造商全称:Analog Devices 功能描述:DSP Microcomputer
ADSP-21160NCBZ-100 功能描述:IC DSP CONTROLLER 32BIT 400-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:SHARC® 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C,McASP,McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA,FCBGA 供应商设备封装:548-FCBGA(27x27) 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA