参数资料
| 型号： | ADT7462ZEVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 42/82页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION FOR ADT7462 |
| 产品变化通告： | MFG CHG Notification ADI to ON Semi |
| 标准包装： | 1 |
| 类型： | 温度传感器 |
| 适用于相关产品： | ADT7462 |
| 所含物品： | 评估板 |
| 其它名称： | EVAL-ADT7462EBZ EVAL-ADT7462EBZ-ND |
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ADT7462
VENTS
I/O CARDS
FAN
POWER
SUPPLY
VENTS
I/O CARDS
FAN
POWER
SUPPLY
based on system performance and measured temperature.
This is important because, instead of designing for the worst
case, the system thermals can be defined as operating zones.
The ADT7462 can self-adjust its fan control loop to
maintain either an operating zone temperature or a system
GOOD CPU AIRFLOW
FAN
CPU
DRIVE
BAYS
POOR CPU
AIRFLOW
CPU
DRIVE
BAYS
target temperature. For example, it can be specified that
ambient temperature in a system be maintained at 50 ? C. If
the temperature is below 50 ? C, the fans might not need to run
or might run very slowly. If the temperature is higher than
VENTS
GOOD VENTING = POOR VENTING =
GOOD AIR EXCHANGE POOR AIR EXCHANGE
Figure 65. Chassis Airflow Issues
? Worst-Case Processor Power Consumption
This data sheet maximum does not necessarily reflect
the true processor power consumption. Designing for
worst-case CPU power consumption can result in a
processor becoming over-cooled (generating excess
system noise).
? Worst-Case Peripheral Power Consumption
The tendency is to design to data sheet maximums for
peripheral components (again over-cooling the system).
? Worst-Case Assembly
Every system manufactured is unique because of
manufacturing variations. Heat sinks may be loose
fitting or slightly misaligned. Too much or too little
thermal grease may be used. Variations in application
pressure for thermal interface material can affect the
efficiency of the thermal solution. Accounting for
manufacturing variations in every system is difficult;
therefore, the system must be designed for the
worst-case.
50 ? C, the fans need to throttle up.
The challenge presented by any thermal design is finding
the right settings to suit the system’s fan control solution.
This can involve designing for the worst case, followed by
weeks of system thermal characterization and, finally, fan
acoustic optimization (for psycho-acoustic reasons).
Obtaining the greatest benefit from the automatic fan
control mode involves characterizing the system to find the
best T MIN and T RANGE settings for the control loop and the
best PWM MIN value for the quietest fan speed setting. Using
the ADT7462 dynamic T MIN control mode, however,
shortens the characterization time and alleviates tweaking the
control loop settings, because the device can self-adjust
during system operation.
Dynamic T MIN control mode is operated by specifying the
operating zone temperatures required for the system.
Remote 1 and Remote 2 channels have dedicated operating
point registers. This allows the system thermal solution to be
broken down into distinct thermal zones. For example, CPU
operating temperature is 70 ? C, VRM operating temperature
is 80 ? C, and ambient operating temperature is 50 ? C. The
ADT7462 dynamically alters the control solution to
maintain each zone temperature as close as possible to its
target operating point.
HEAT
SINK
THERMAL
INTERFACE
MATERIAL
INTEGRATED
HEAT
SPREADER
SUBSTRATE
PROCESSOR
θ SA
θ TIMS
θ CTIM
θ TIMC
θ JTIM
T A
T S
T TIM
T C
T TIM
θ CS
θ CA
θ JA
Figure 67 shows an overview of the parameters that affect
the operation of the dynamic T MIN control loop.
EPOXY
THERMAL INTERFACE MATERIAL
Figure 66. Thermal Model
T J
TEMPERATURE
T HIGH
T RANGE
Although a design usually accounts for worst-case
conditions in all these cases, the actual system is almost
never operated at worst-case conditions. The alternative to
designing for the worst case is to use the dynamic T MIN
control function.
T LOW T MIN OPERATING T THERM
POINT
Figure 67. Dynamic T MIN Control Loop
Dynamic T MIN Control Overview
Dynamic T MIN control mode builds upon the basic
automatic fan control loop by adjusting the T MIN value
http://onsemi.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADT7463 | 制造商:AD 制造商全称:Analog Devices 功能描述:dB COOL Remote Thermal Controller and Voltage Monitor |
| ADT7463ARQ | 功能描述:IC REMOTE THERMAL CTRLR 24-QSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热管理 系列:dBCool® 标准包装:1 系列:- 功能:温度监控系统（传感器） 传感器类型:内部和外部 感应温度:-40°C ~ 125°C，外部传感器 精确度:±2.5°C 本地（最大值），±5°C 远程（最大值） 拓扑:ADC，比较器，寄存器库 输出类型:2 线 SMBus? 输出警报:无 输出风扇:无 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-8 供应商设备封装:SOT-23-8 包装:Digi-Reel® 其它名称:296-22675-6 |
| ADT7463ARQ-REEL | 功能描述:IC SENSOR TEMP FAN-CTRL 24QSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热管理 系列:dBCool® 标准包装:1 系列:- 功能:温度监控系统（传感器） 传感器类型:内部和外部 感应温度:-40°C ~ 125°C，外部传感器 精确度:±2.5°C 本地（最大值），±5°C 远程（最大值） 拓扑:ADC，比较器，寄存器库 输出类型:2 线 SMBus? 输出警报:无 输出风扇:无 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-8 供应商设备封装:SOT-23-8 包装:Digi-Reel® 其它名称:296-22675-6 |
| ADT7463ARQ-REEL7 | 功能描述:IC SENSOR TEMP FAN-CTRL 24QSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热管理 系列:dBCool® 标准包装:1 系列:- 功能:温度监控系统（传感器） 传感器类型:内部和外部 感应温度:-40°C ~ 125°C，外部传感器 精确度:±2.5°C 本地（最大值），±5°C 远程（最大值） 拓扑:ADC，比较器，寄存器库 输出类型:2 线 SMBus? 输出警报:无 输出风扇:无 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-8 供应商设备封装:SOT-23-8 包装:Digi-Reel® 其它名称:296-22675-6 |
| ADT7463ARQZ | 功能描述:马达/运动/点火控制器和驱动器 SYS MGMT CNTRLR IC RoHS:否 制造商:STMicroelectronics 产品:Stepper Motor Controllers / Drivers 类型:2 Phase Stepper Motor Driver 工作电源电压:8 V to 45 V 电源电流:0.5 mA 工作温度:- 25 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:HTSSOP-28 封装:Tube |
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