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| 型号： | ADUC832BCPZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 84/92页 |
| 文件大小： | 0K |
| 描述： | IC MCU 62K FLASH ADC/DAC 56LFCSP |
| 标准包装： | 1 |
| 系列： | MicroConverter® ADuC8xx |
| 核心处理器： | 8052 |
| 芯体尺寸： | 8-位 |
| 速度： | 16MHz |
| 连通性： | EBI/EMI，I²C，SPI，UART/USART |
| 外围设备： | PSM，温度传感器，WDT |
| 输入/输出数： | 34 |
| 程序存储器容量： | 62KB（62K x 8） |
| 程序存储器类型： | 闪存 |
| EEPROM 大小： | 4K x 8 |
| RAM 容量： | 2.25K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 2.7 V ~ 5.5 V |
| 数据转换器： | A/D 8x12b，D/A 2x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 56-VFQFN 裸露焊盘，CSP |
| 包装： | 托盘 |
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Data Sheet
ADuC832
Rev. B | Page 85 of 92
GROUNDING AND BOARD LAYOUT
RECOMMENDATIONS
As with all high resolution data converters, special attention
must be paid to grounding and PCB layout of ADuC832- based
designs to achieve optimum performance from the ADC and
DACs. Although the ADuC832 has separate pins for analog and
digital ground (AGND and DGND), the user must not tie these
to two separate ground planes unless the two ground planes are
connected together very close to the ADuC832, as illustrated in
the simplified example of Figure 93a. In systems where digital
and analog ground planes are connected together at some other
location (at the system’s power supply, for example), they cannot
be connected again near the ADuC832 because a ground loop then
results. In these cases, tie all the ADuC832 AGND and DGND
pins to the analog ground plane, as illustrated in Figure 93b. In
systems with only one ground plane, ensure that the digital and
analog components are physically separated onto separate halves
of the board such that digital return currents do not flow near
analog circuitry and vice versa. The ADuC832 can then be
placed between the digital and analog sections, as illustrated in
In all of these scenarios, and in more complicated real-life
applications, keep in mind the flow of current from the supplies
and back to ground. Make sure the return paths for all currents
are as close as possible to the paths the currents traveled to reach
their destinations. For example, do not power components on
return currents from DVDD to flow through AGND. Also, try
to avoid digital currents flowing under analog circuitry, which
may happen if the user places a noisy digital chip on the left
half of the board in Figure 93c. Whenever possible, avoid large
discontinuities in the ground plane(s) (such as are formed by a
long trace on the same layer), because they force return signals
to travel a longer path. Also, make all connections to the ground
plane directly, with little or no trace separating the pin from its
via to ground.
To connect fast logic signals (rise/fall time < 5 ns) to any of the
ADuC832 digital inputs, add a series resistor to each relevant
line to keep rise and fall times longer than 5 ns at the ADuC832
input pins. A value of 100 Ω or 200 Ω is usually sufficient to
prevent high speed signals from coupling capacitively into the
ADuC832 and affecting the accuracy of ADC conversions.
b.
DGND
AGND
c.
GND
a.
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
DGND
AGND
02
98
7-
0
81
Figure 93. System Grounding Schemes
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADUC832BCPZ-REEL | 功能描述:IC MCU 62K FLASH ADC/DAC 56LFCSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC8xx 标准包装:38 系列:Encore!® XP® 核心处理器:eZ8 芯体尺寸:8-位 速度:5MHz 连通性:IrDA，UART/USART 外围设备:欠压检测/复位，LED，POR，PWM，WDT 输入/输出数:16 程序存储器容量:4KB（4K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:1K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 3.6 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 105°C 封装/外壳:20-SOIC（0.295"，7.50mm 宽） 包装:管件 其它名称:269-4116Z8F0413SH005EG-ND |
| ADUC832BS | 制造商:Analog Devices 功能描述:MCU 8-Bit ADuC8xx 8052 CISC 62KB Flash 3.3V/5V 52-Pin MQFP 制造商:Rochester Electronics LLC 功能描述:8BIT CISC 62KB FLASH 16.78MHZ 3.3/5V 52MQFP - Bulk 制造商:Analog Devices 功能描述:8BIT MCU +12BIT ADC LQFP52 832 |
| ADUC832BS-REEL | 制造商:Analog Devices 功能描述:MCU 8-Bit ADuC8xx 8052 CISC 62KB Flash 3.3V/5V 52-Pin MQFP T/R |
| ADUC832BSZ | 功能描述:IC ADC/DAC 12BIT W/MCU 52MQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC8xx 标准包装:250 系列:56F8xxx 核心处理器:56800E 芯体尺寸:16-位 速度:60MHz 连通性:CAN，SCI，SPI 外围设备:POR，PWM，温度传感器，WDT 输入/输出数:21 程序存储器容量:40KB（20K x 16） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:6K x 16 电压 - 电源 (Vcc/Vdd):2.25 V ~ 3.6 V 数据转换器:A/D 6x12b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:48-LQFP 包装:托盘 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| ADUC832BSZ-REEL | 功能描述:IC MCU 62K FLASH ADC/DAC 52MQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC8xx 标准包装:38 系列:Encore!® XP® 核心处理器:eZ8 芯体尺寸:8-位 速度:5MHz 连通性:IrDA，UART/USART 外围设备:欠压检测/复位，LED，POR，PWM，WDT 输入/输出数:16 程序存储器容量:4KB（4K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:1K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 3.6 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 105°C 封装/外壳:20-SOIC（0.295"，7.50mm 宽） 包装:管件 其它名称:269-4116Z8F0413SH005EG-ND |
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