参数资料
型号: APA150-FG144
厂商: Microsemi SoC
文件页数: 112/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 150K 144-FBGA
标准包装: 160
系列: ProASICPLUS
RAM 位总计: 36864
输入/输出数: 100
门数: 150000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 144-LBGA
供应商设备封装: 144-FPBGA(13x13)
ProASICPLUS Flash Family FPGAs
v5.9
2-29
Logic-Tile Contribution—Plogic
Plogic, the logic-tile component of AC power dissipation, is given by
Plogic = P3 * mc * Fs
where:
I/O Output Buffer Contribution—Poutputs
Poutputs, the I/O component of AC power dissipation, is given by
Poutputs = (P4 + (Cload * VDDP
2)) * p * Fp
where:
I/O Input Buffer's Buffer Contribution—Pinputs
The input’s component of AC power dissipation is given by
Pinputs = P8 * q * Fq
where:
PLL Contribution—Ppll
Ppll = P9 * Npll
where:
RAM Contribution—Pmemory
Finally, Pmemory, the memory component of AC power consumption, is given by
Pmemory = P6 * Nmemory * Fmemory * Ememory
where:
P3
=
1.4
μW/MHz is the average power consumption of a logic tile per MHz of its output toggling rate. The
maximum output toggling rate is Fs/2.
mc
=
the number of logic tiles switching during each Fs cycle
Fs
=
the clock frequency
P4
=
326
μW/MHz is the intrinsic power consumption of an output pad normalized per MHz of the output
frequency. This is the total I/O current VDDP.
Cload =
the output load
p
=
the number of outputs
Fp
=
the average output frequency
P8
=
29
μW/MHz is the intrinsic power consumption of an input pad normalized per MHz of the input
frequency.
q
=
the number of inputs
Fq
=
the average input frequency
P9
=
7.5 mW. This value has been estimated at maximum PLL clock frequency.
NPll
=
number of PLLs used
P6
=
175 W/MHz is the average power consumption of a memory block per MHz of the clock
Nmemory
=
the number of RAM/FIFO blocks
(1 block = 256 words * 9 bits)
Fmemory
=
the clock frequency of the memory
Ememory
=
the average number of active blocks divided by the total number of blocks (N) of the memory.
Typical values for Ememory would be 1/4 for a 1k x 8,9,16, 32 memory and 1/16 for a 4kx8,
9, 16, and 32 memory configuration
In addition, an application-dependent component to Ememory can be considered. For
example, for a 1kx8 memory configuration using only 1 cycle out of 2, Ememory = 1/4*1/2 = 1/8
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相关代理商/技术参数
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APA150-FG144A 功能描述:IC FPGA PROASIC+ 150K 144-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
APA150-FG144I 功能描述:IC FPGA PROASIC+ 150K 144-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
APA150-FG256 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
APA150-FG256A 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
APA150-FG256I 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)