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参数资料
型号： APA150-FG144
厂商： Microsemi SoC
文件页数： 80/178页
文件大小： 0K
描述： IC FPGA PROASIC+ 150K 144-FBGA
标准包装： 160
系列： ProASICPLUS
RAM 位总计： 36864
输入/输出数： 100
门数： 150000
电源电压： 2.3 V ~ 2.7 V
安装类型： 表面贴装
工作温度： 0°C ~ 70°C
封装/外壳： 144-LBGA
供应商设备封装： 144-FPBGA（13x13）
ProASICPLUS Flash Family FPGAs
4- 2
v5.9
v5.1
MIL-STD-883 was added to the datasheet.
N/A
VCC and VCCI were changed to VDDP.
N/A
Table 2-9 Temperature and Voltage Derating Factors was updated to include 135°C.
2-17
v5.0
In the "208-Pin PQFP" table, the following pin numbers have been updated:
Pin Number
Function
24
I/O / GL2
30
I/O / GL1
3-6
In the "208-Pin CQFP" table, the following pin numbers have been updated:
Pin Number
Function
23
I/O / GLMX1
24
I/O / GL2
28
PPECL1 / Input
30
I/O / GL1
128
I/O / GL3
129
PPECL2 / Input
134
I/O / GL4
135
I/O / GLMX2
3-13
v4.1
In the "624-Pin CCGA/LGA" table, the following pin numbers have been updated:
Pin Number
Function
M6
I/O / GL2
M7
I/O / GLMX1
M19
I/O / GLMX2
M20
I/O / GL4
N5
PPECL1 / Input
N6
I/O / GL1
N20
I/O / GL3
N21
PPECL2 / Input
3-79
MIL-STD 883B data will be added into this datasheet after the MIL-STD 883B qualification is
complete.
Green packaging information in the "Ordering Information" section was updated.
ii
The "Temperature Grade Offerings" table was updated for the CG624.
iv
The "Ordering Information" section was updated.
ii
The "Live at Power-Up" section is new.
1-3
Note 2 in Figure 2-1 Ultra-Fast Local Resources was updated.
2-1
The 3.3 V column in Table 2-3 was updated.
2-6
The "Input/Output Blocks" section was updated.
2-6
The note was removed from Table 2-4 I/O Features.
2-6
The "Power-Up Sequencing" section was updated.
2-7
The first bullet in the "ProASICPLUS Clock Management System" section was updated.
2-10
The first paragraph in the "Performance Retention" section was updated.
2-31
Mixed Voltage was removed from Table 2-20 Recommended Maximum Operating
Conditions Programming and PLL Supplies.
2-33
Table 2-21 Recommended Operating Conditions was updated.
2-33
Mixed Mode Voltage was removed from Table 2-22 and the Military/MIL-STD-883B column was
updated.
2-34
All tables from Table 2-27 Worst-Case Commercial Conditions to Table 2-47 Worst-Case
Military Conditions1 were updated.
2-42 to
2-51
Table 2-50 JTAG Switching Characteristics is new.
2-53
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Changes in current version (v5.9)
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相关代理商/技术参数
参数描述
APA150-FG144A 功能描述:IC FPGA PROASIC+ 150K 144-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17）
APA150-FG144I 功能描述:IC FPGA PROASIC+ 150K 144-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27）
APA150-FG256 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17）
APA150-FG256A 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17）
APA150-FG256I 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27）
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