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参数资料
型号： BX805555030P
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 64-BIT, MICROPROCESSOR, BGA771
封装： LGA-771
文件页数： 23/104页
文件大小： 3690K
代理商： BX805555030P
Dual-Core Intel Xeon Processor 5000 Series Datasheet
25
Electrical Specifications
Notes:
1.
For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must
be satisfied.
2.
Overshoot and undershoot voltage guidelines for input, output, and I/O signals are outlined in Section 3.
Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor.
3.
Storage temperature is applicable to storage conditions only. In this scenario, the processor must not
receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect
the long-term reliability of the device. For functional operation, please refer to the processor case
temperature specifications.
4.
This rating applies to the processor and does not include any tray or packaging.
5.
Failure to adhere to this specification can affect the long term reliability of the processor.
2.12
Processor DC Specifications
The processor DC specifications in this section are defined at the processor
core (pads) unless noted otherwise. See Section 4.1 for the Dual-Core Intel Xeon
Processor 5000 series land listings and Section 5.1 for signal definitions. Voltage and
current specifications are detailed in Table 2-10. For platform planning refer to
Table 2-11, which provides Voltage-Current projections. This same information is
presented graphically in Figure 2-4.
BSEL[2:0] and VID[5:0] signals are specified in Table 2-12. The DC specifications for
the AGTL+ signals are listed in Table 2-13. Legacy signals and Test Access Port (TAP)
signals follow DC specifications similar to GTL+. The DC specifications for the
PWRGOOD input and TAP signal group are listed in Table 2-14 and the Asynchronous
GTL+ signal group is listed in Table 2-15. The VTTPWRGD signal is detailed in
Table 2-16.
Table 2-10 through Table 2-16 list the DC specifications for the processor and are valid
only while meeting specifications for case temperature (TCASE as specified in Table 6-1),
clock frequency, and input voltages. Care should be taken to read all notes
associated with each parameter.
Table 2-10. Voltage and Current Specifications (Sheet 1 of 2)
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1,13
VID
VID range
1.0750
1.3500
V
VCC
VCC for Dual-Core Intel Xeon
Processor 5000 series core. FMB
processor.
See Table 2-11 and Figure 2-4
V
2, 3, 4, 6,
11
VVID_STEP
VID step size during a transition
± 12.5
mV
VVID_SHIFT
Total allowable DC load line shift
from VID steps
425
mV
12
VTT
FSB termination voltage (DC + AC
specification)
1.140
1.20
1.260
V
10, 14
ICC
ICC for Dual-Core Intel Xeon
Processor 5000 series with multiple
VID (667 MHz)
115
A
4, 5, 6, 11
ICC
ICC for Dual-Core Intel Xeon
Processor 5000 series with multiple
VID (1066 MHz)
150
A
4, 5, 6, 11
ICC
ICC for Dual-Core Intel Xeon
Processor 5063 (MV) with multiple
VID
115
A
4, 5, 6, 11
ICC_RESET
ICC_RESET for Dual-Core Intel Xeon
Processor 5000 series with multiple
VID (667 MHz)
115
A
18
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相关代理商/技术参数
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BX805555050A S L96C 制造商:Intel 功能描述:XEON PROCESSOR 5050
BX805555060A S L96A 制造商:Intel 功能描述:MPU Xeon 65nm 3.2GHz 771-Pin FCLGA6
BX805555060P S L96A 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5060 65nm 3.2GHz 771-Pin FCLGA6
BX805565120P S L9RY 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5120 RISC 64-Bit 65nm 1.86GHz 771-Pin LGA Box
BX805565130A S LAGC 制造商:Intel 功能描述:5100 MEMORY CONTROLLER HUB CHIPSET
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