参数资料
型号: BX805555030P
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, MICROPROCESSOR, BGA771
封装: LGA-771
文件页数: 96/104页
文件大小: 3690K
代理商: BX805555030P
Dual-Core Intel Xeon Processor 5000 Series Datasheet
91
Boxed Processor Specifications
8.2.1
Boxed Processor Heat Sink Dimensions (CEK)
The boxed processor will be shipped with an unattached thermal solution. Clearance is
required around the thermal solution to ensure unimpeded airflow for proper cooling.
The physical space requirements and dimensions for the boxed processor and
assembled heat sink are shown in Figure 8-4 through Figure 8-8. Figure 8-9 through
Figure 8-10 are the mechanical drawings for the 4-pin board fan header and 4-pin
connector used for the active CEK fan heat sink solution.
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