参数资料
型号: BX805555030P
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, MICROPROCESSOR, BGA771
封装: LGA-771
文件页数: 95/104页
文件大小: 3690K
代理商: BX805555030P
Boxed Processor Specifications
90
Dual-Core Intel Xeon Processor 5000 Series Datasheet
Notes:
1.
The heat sinks represented in these images are for reference only, and may not represent the final boxed
processor heat sinks.
2.
The screws, springs, and standoffs will be captive to the heat sink. This image shows all of the components
in an exploded view.
3.
It is intended that the CEK spring will ship with the base board and be pre-attached prior to shipping.
8.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor.
Figure 8-2. Boxed Dual-Core Intel Xeon Processor 5000 Series 2U Passive Heat Sink
Figure 8-3. 2U Passive Dual-Core Intel Xeon Processor 5000 Series Thermal Solution
(Exploded View)
Heat sink
Heat sink standoffs
Heat sink screw
springs
Thermal Interface
Material
Heat sink
screws
Motherboard
and
processor
Chassis pan
Protective Tape
CEK spring
Heat sink
Heat sink standoffs
Heat sink screw
springs
Thermal Interface
Material
Heat sink
screws
Motherboard
and
processor
Chassis pan
Protective Tape
CEK spring
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