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参数资料
| 型号： | BX805555030P |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, MICROPROCESSOR, BGA771 |
| 封装： | LGA-771 |
| 文件页数： | 25/104页 |
| 文件大小： | 3690K |
| 代理商： | BX805555030P |
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Dual-Core Intel Xeon Processor 5000 Series Datasheet
27
Electrical Specifications
11. Minimum VCC and maximum ICC are specified at the maximum processor case temperature (TCASE)
shown in Table 6-1.
12. This specification refers to the total reduction of the load line due to VID transitions below the specified
VID.
13. Individual processor VID values may be calibrated during manufacturing such that two devices at the same
frequency may have different VID settings.
14. Baseboard bandwidth is limited to 20 MHz.
15. ICC_TDC is the sustained (DC equivalent) current that the processor is capable of drawing indefinitely and
should be used for the voltage regulator temperature assessment. The voltage regulator is responsible for
monitoring its temperature and asserting the necessary signal to inform the processor of a thermal
excursion. Please see the applicable design guidelines for further details. The processor is capable of
drawing ICC_TDC indefinitely. Refer to Figure 2-2 and Figure 2-3 for further details on the average processor
current draw over various time durations. This parameter is based on design characterization and is not
tested.
16. This specification is per-processor. This is a steady-state ITT current specification, which is applicable when
both VTT and VCC are high. This parameter is based on design characterization and is not tested. Please
refer to the ITT Analysis of System Bus Components - Bensley Platform Whitepaper for platform
implementation guidance.
17. I
CC
_VTTOUT is specified at 1.2 V.
18.ICC_RESET is specified while PWRGOOD and RESET# are asserted.
19. This specification is per-processor. This is a power-up peak current specification, which is applicable when
VTT is powered up and VCC is not. This parameter is based on design characterization and is not tested.
Notes:
1.
Processor or Voltage Regulator thermal protection circuitry should not trip for load currents greater than
ICC_TDC.
2.
Not 100% tested. Specified by design characterization.
Figure 2-2. Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Load Current
versus Time
125
130
135
140
145
150
155
0.01
0.1
1
10
100
1000
Time Duration (s)
S
u
st
ai
n
e
d
C
u
rr
e
n
t
(A
)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX805555050A S L96C | 制造商:Intel 功能描述:XEON PROCESSOR 5050 |
| BX805555060A S L96A | 制造商:Intel 功能描述:MPU Xeon 65nm 3.2GHz 771-Pin FCLGA6 |
| BX805555060P S L96A | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5060 65nm 3.2GHz 771-Pin FCLGA6 |
| BX805565120P S L9RY | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5120 RISC 64-Bit 65nm 1.86GHz 771-Pin LGA Box |
| BX805565130A S LAGC | 制造商:Intel 功能描述:5100 MEMORY CONTROLLER HUB CHIPSET |
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