参数资料
型号: E28F200B5B60
厂商: INTEL CORP
元件分类: PROM
英文描述: DIRECTIONAL COUPLER, 20DB, SMT
中文描述: 256K X 8 FLASH 5V PROM, 70 ns, PDSO48
封装: 12 X 20 MM, TSOP-48
文件页数: 23/44页
文件大小: 345K
代理商: E28F200B5B60
E
28F200B5, 28F004/400B5, 28F800B5
3
PRELIMINARY
CONTENTS
PAGE
1.0 INTRODUCTION..............................................5
1.1 Product Overview .........................................5
2.0 PRODUCT DESCRIPTION ..............................6
2.1 Pin Descriptions ...........................................6
2.2 Pinouts .........................................................8
2.3 Memory Blocking Organization...................10
2.3.1 One 16-KB Boot Block.........................10
2.3.2 Two 8-KB Parameter Blocks................10
2.3.3 Main Blocks - One 96-KB + Additional
128-KB Blocks....................................10
3.0 PRINCIPLES OF OPERATION .....................13
3.1 Bus Operations ..........................................13
3.1.1 Read....................................................13
3.1.2 Output Disable.....................................14
3.1.3 Standby ...............................................14
3.1.4 Word/Byte Configuration......................14
3.1.5 Deep Power-Down/Reset ....................14
3.1.6 Write....................................................14
3.2 Modes of Operation....................................16
3.2.1 Read Array ..........................................16
3.2.2 Read Identifier .....................................16
3.2.3 Read Status Register...........................16
3.2.4 Word/Byte Program .............................17
3.2.5 Block Erase .........................................17
3.3 Boot Block Locking.....................................24
3.3.1 VPP = VIL for Complete Protection........24
3.3.2 WP# = VIL for Boot Block Locking........24
3.3.3 RP# = VHH or WP# = VIH for Boot Block
Unlocking ...........................................24
3.3.4 Note For 8-Mbit 44-PSOP Package .....24
4.0 DESIGN CONSIDERATIONS ........................24
4.1 Power Consumption ...................................24
4.1.1 Active Power .......................................24
4.1.2 Automatic Power Savings (APS) .........24
4.1.3 Standby Power ....................................25
4.1.4 Deep Power-Down Mode.....................25
4.2 Power-Up/Down Operation........................ 25
4.2.1 RP# Connected To System Reset ...... 25
4.3 Board Design............................................. 25
4.3.1 Power Supply Decoupling ................... 25
4.3.2 VPP Trace on Printed Circuit Boards ... 25
5.0 ELECTRICAL SPECIFICATIONS................. 26
5.1 Absolute Maximum Ratings ....................... 26
5.2 Operating Conditions................................. 26
5.3 Capacitance .............................................. 27
5.4 DC Characteristics—Commercial and
Extended Temperature ............................. 27
5.5 DC Characteristics—Automotive
Temperature............................................. 29
5.6 AC Characteristics—Read Operations—
Commercial and Extended Temperature .. 34
5.7 AC Characteristics—Read Operations—
Automotive Temperature .......................... 35
5.8 Erase and Program Timings—Commercial
and Extended Temperature ...................... 36
5.9 Erase and Program Timings—Automotive
Temperature............................................. 37
5.10 AC Characteristics—Write Operations—
Commercial and Extended Temperature .. 38
5.11 AC Characteristics—Write Operations—
Automotive Temperature .......................... 39
6.0 ORDERING INFORMATION......................... 41
7.0 ADDITIONAL INFORMATION ...................... 42
APPENDIX A: Write State Machine: Current-
Next State Chart ......................................... 43
APPENDIX B: Product Block Diagram ............. 44
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