参数资料
型号: IR3500VMTRPBF
厂商: International Rectifier
文件页数: 30/34页
文件大小: 0K
描述: IC XPHASE3 CTLR VR11.1 32-MLPQ
标准包装: 1
系列: XPhase3™
应用: 处理器
电流 - 电源: 6.5mA
电源电压: 4.75 V ~ 7.5 V
工作温度: 0°C ~ 100°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘
供应商设备封装: 32-MLPQ(5x5)
包装: 标准包装
其它名称: IR3500VMTRPBFDKR
IR3500V
PCB LAYOUT GUIDELINES
The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB
layout, therefore minimizing the noise coupled to the IC.
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Dedicate at least one middle layer for a ground plane LGND.
Connect the ground tab under the control IC to LGND plane through a via.
Place VCCL decoupling capacitor VCCL as close as possible to VCCL and LGND pins.
Place the following critical components on the same layer as control IC and position them as close as possible
to the respective pins, R OSC , R OCSET , R VDAC , C VDAC , and C SS/DEL . Avoid using any via for the connection.
Place the compensation components on the same layer as control IC and position them as close as possible to
EAOUT, FB, VO and VDRP pins. Avoid using any via for the connection.
Use Kelvin connections for the remote voltage sense signals, VOSNS+ and VOSNS-, and avoid crossing over
the fast transition nodes, i.e. switching nodes, gate drive signals and bootstrap nodes.
Avoid analog control bus signals, VDAC, IIN, and especially EAOUT, crossing over the fast transition nodes.
Separate digital bus, CLKOUT, PHSOUT and PHSIN from the analog control bus and other compensation
components.
LGND
PLANE
To
Phase ICs
VDAC
VDAC
To
Phase
To OVP
C
R
R OSC/OVP
SS/DEL
DRP
C
ICs
SS/DEL OCSET
VDAC
Circuit
C
ROSC / OVP
LGND
VSETPT
VDRP
DRP
R
CP
C
FB
R
CP
R
CP1
C
FB1
CLKOUT
PHSOUT
IIN
EAOUT
FB
FB1
R
C
FB2
R
PHSIN
VO
VCCL
VCCL
VOSNS+
C
To
LGND
VCCL1
R
VCCLFB
VCCLDRV
VRRDY
VOSNS-
HOTSET
VRHOT
HOTSET2 HOTSET1
To
Thermistor
To Voltage
Remote
VIDSEL
ENABLE
Sense
VCCLDRV
VID7 VID6 VID5 VID4VID3 VID2 VID1 VID0
R
R
To VCCL
To
R
Thermistor
R VCCL2
Page 30 of 34
To VIN
To SYSTEM
July 28, 2008
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IR3502AMTRPBF 功能描述:IC XPHASE CTRL VR11.0/1 32-MLPQ RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase3™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像,声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP(8x8) 包装:管件